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Intevac, TES enter semiconductor tool development, manufacturing, sales alliance

22 September 2008 | Wafer Processing
intevac_leanetchIntevac and TES Co. have entered into a semiconductor capital equipment business alliance covering product development, manufacturing, and sales of the companies' chipmaking gear. Read more >>

Sumitomo fails to make offer for Axcelis

17 September 2008 | Wafer Processing
Axcelis HQAccording to an SEC filing, rather than through a press release, Axcelis has stated that Sumitomo Heavy Industries (SHI), would not be making an official bid for the company after a period of due diligence. Read more >>

Novellus’ resist strip system becomes tool of record at major Asian foundry

16 September 2008 | Wafer Processing
Novellus Gamma toolNovellus Systems has said that its Gamma GxT photoresist strip system has become a process tool of record at a major Asia based foundry. The tool has been qualified for 45nm production. Read more >>

50th anniversary of the Integrated Circuit

12 September 2008 | Wafer Processing
Jack Kilby with notebookThe first public demonstration of the integrated circuit by Jack Kilby at Texas Instruments research lab in Dallas, Texas took place today, 50 years ago. Jack Kilby’s contribution to electronics and the semiconductor industry as a whole was recognized in 2000 when he was awarded the Nobel Prize in Physics. Read more >>

NEC Electronics joins IBM in 32nm and below process development

11 September 2008 | Wafer Processing
IBM airgap process technologyNEC Electronics has become the eighth IBM led joint development alliance member following Chartered Semiconductor, Freescale, Infineon, Samsung Electronics, STMicroelectronics and Toshiba Corporation. NEC is set to work on process technology for the 32nm node and below. NEC is also a partner with Toshiba on process technologies. Read more >>

Synopsys and Ovonyx to work on phase change memory device simulation models

11 September 2008 | Wafer Processing
Ovonyx phase change memory Ovonyx is to provide Synopsys with material and device characterization data for Synopsys to develop and calibrate TCAD models for phase change memory (PCM),  device simulation. The companies are expecting the collaboration will improve modeling accuracy for Synopsys’ Sentaurus TCAD tools. Read more >>

Tool Order: SUSS MicroTec wins 300mm ProbeShield system order

05 September 2008 | Wafer Processing
SUSS MicroTec ProbeShield system A major Asian memory manufacturer has placed an order with SUSS MicroTec Test Systems for a 300mm wafer-level probe system, the PA300PS. The decision follows a six-month, head-to-head comparison against the incumbent and major competition for wafer-level test solutions at the manufacturer’s facilities, the company said. The system will be used for IC device characterization and reliability testing. Read more >>

Tool Order: Rudolph wins multiple WaferWoRx 300 Probing system deal

04 September 2008 | Wafer Processing
A major European semiconductor manufacturer has ordered two ‘WaferWoRx’ 300 Probing Process Analysis Systems from Rudolph Technologies. The orders were placed as part of a multi-tool agreement signed in June 2008. Read more >>

PDF Solutions buys Triant for $1.75 million

28 August 2008 | Wafer Processing
Triant PDF Solutions is to acquire Triant Holdings for $1.75 million in cash, which includes existing customer contracts, technologies and employees. Applied Materials had acquired a 12.5 percent equity in Triant Technologies for an investment of $2.2 million in 1999. Triant is known for its fault detection software technology. Read more >>

Lam Research establishes global center for customer training in Taiwan

27 August 2008 | Wafer Processing
Lam ResearchLam Research has opened a new 3,600-plus square foot facility in Hsinchu, Taiwan that will become Lam’s global center for customer training, related to its 200mm and 300mm etch processing tools. Read more >>