Online information source for semiconductor professionals

Austria-based NanoTecCenter Weiz Forschungsgesellschaft mbH (NTC Weiz) has placed an order with EV Group for an EVG620 precision alignment system. NTC Weiz will use the system for its new R&D facility, which will be focussed on organic/plastic electronic technologies. Read more >>

IBM and Hitachi are to begin a two-year joint semiconductor metrology research program in the development of next-generation 32- and 22-nanometer devices, which will be the first time the two companies have directly collaborated together. Read more >>

Sumitomo Heavy Industries’ unsuccessful bid for Axcelis valued the company at approximately $544 million, or $5.20 per share in early February. A revised proposal has been released, which sees the offer increase to $6.00 per cash share, or approximately $630 million. Read more >>

Israel Growth Partners Acquisition Corporation (GPAC), an Israeli blank check company, is to take control of Israel-based metrology firm Negevtech.  Following the transaction, Negevtech will have access to approximately $55 million currently held in IGPAC's trust account.  Approximately $11 million will be used for working capital and to repay some of Negevtech’s indebtedness. IGPAC CEO is Carmel Vernia, former Chairman and CEO of Tower Semiconductor. Read more >>

A memory manufacturer based in Asia has selected Rudoph Technologies’ MetaPULSE-III opaque film metrology system for all aspects of copper metrology requirements at a fab transitioning from aluminum to copper interconnects. A system has been already been shipped to the customer, Rudolph said. Read more >>

China’s largest foundry has placed a multi-million dollar follow-on order with Nova Measuring Instruments for NovaScan stand-alone metrology, integrated metrology and NovaMARS application development solutions. Read more >>

Qcept Technologies has raised $9.5 million in Series C funding, bringing its total VC funding close to $25 million. The funds will be used to ramp production and service new customers for its non-visual defect inspection tool, the ChemetriQ. Read more >>

Micron Technology and Nanya Technology have confirmed previous reports that the two memory manufacturers were planning a joint venture that could include both a technology and a manufacturing partnership. The two companies have now signed a memorandum of understanding to explore potential partnerships in these areas and expect a definitive agreement to be made in the next few months.

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Oxford Instruments Plasma Technology Ltd (OIPT) has received 20 tool orders in the month of February, one of which was for five production tools for a manufacturing facility in Malaysia. A separate order included an Ion Beam Cluster System to the value of over £1million (approx. $2 million), according to the company. Read more >>

IBM and Rohm and Haas Electronic Materials are to collaborate on CMP process development for copper and low-k dielectrics integration at the 32nm and 22nm nodes. Under a signed joint development agreement (JDA) the companies will create a complete CMP consumables solution to enable volume manufacturing. The news comes on the back of an announcement that the two companies would also collaborate on photoresist and implant steps at the same technology nodes. Read more >>