Online information source for semiconductor professionals

Tegal and EV Group have both landed orders for their process tools from major MEMS device manufacturers. Read more >>

ASM International and the University of Helsinki have renewed their long-term research agreement in the area of atomic layer deposition (ALD) for another five years, extending the partnership of two of the pioneering organizations in the field.
             Read more >>

Using Aixtron's atomic vapor deposition technology, which features the pulsed injection of liquid precursors for precise deposition, Aixtron and Ovonyx plan to develop the second-generation deposition technology required for the scaling of phase-change memory (PCM). According to the companies, physical vapor deposition (PVD) processes will be used for the initial production ramp of PSM devices. Read more >>

An early victim in the current semiconductor downturn and credit crunch, wafer cleaning equipment supplier from Japan, S.E.S. Co Ltd., has filed for bankruptcy under the corporate rehabilitation law of Japan. With debts of 14.273 billion yen (US$158. million), S.E.S President, Masaya Shibagaki has also resigned, the company said. Read more >>

Axcelis Technologies has missed an interest payment due January 15, 2009 on a 4.25% Convertible Senior Subordinated Note valued at approximately US$85 million when a maturity premium is included. Axcelis said in a statement that the freeze in the global credit markets has hindered its ability to refinance debt. Axcelis said that it was continuing to engage with other lenders and the note holder. Read more >>

Strasbaugh has said it has shipped an nSpire R&D CMP system to China's Tianjin University of Technology in December, 2008. Recently, Strasbaugh announced a US$2.85 million order from a Chinese IC manufacturer. The nSpire will be installed in one of Tianjin's high-tech research and development laboratories, expanding the University's semiconductor R&D capability. Read more >>

KLA-Tencor has lowered guidance for the fourth quarter of 2008, citing a sharp deterioration in business as semiconductor manufacturers cut capital spending and push out fab expansions. Bookings have decline sequentially in 2008 for KLA-Tencor. The latest guidance indicates new bookings are expected to be in the range of US$235 - US$245 million, down from its original 3Q guidance of US$325 million, flat plus or minus 10%. Total revenue was expected to be in the range of US$410 and US$430 million, compared to the revised figure of between US$$390 - US$400 million. Read more >>

Fourth quarter 2008, financial results at Tokyo Electron continue to reflect the significant decline in capital spending from customers in the flat panel display and semiconductor industries. New orders declined approximately 74% to approximately US$400 million, compared to the same period in 2007 and approximately 65% Q-on-Q, the lowest level since the 2001 major downturn in the industry. Read more >>

Due to the decline in front-end equipment sales and the subsequent under-utilization of its sub-assembly equipment facility in Singapore, ASM International is increasing the pace of shifting products currently manufactured in The Netherlands to Singapore. In a plan originally set out in April, 2008 to reduce operating costs and return to profitability in its front-end division, ASM began shifting generic parts and subassemblies of its vertical furnaces, epitaxy and PECVD tools and components for its ALD tools to Singapore. In the latest transfer phase all vertical furnace manufacturing will move to Singapore over the next 12 months, the company said. Read more >>

Surfacing technology company Strasbaugh has announced that it shipped equipment worth $2.85 million to a China-based IC manufacturer in December 2008. The sale was secured by China's 45th Research Institute, a sales and service partner of Strasbaugh's, and consists of multiple CMP and cleaning systems for use in the Chinese company’s chip manufacturing. Read more >>