Test chips from EDA vendors, Cadence Design Systems, Magma Design
Automation, Mentor Graphics and Synopsys have been successfully taped
out at Globalfoundries, signalling its readiness for customers to begin
evaluating their 20nm designs.
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X-FAB
Silicon Foundries Group is to form a strategic partnership with sensor and IC
systems-provider Micronas.
Although the bigger value orders seen placed by TSMC in the earlier part
of the year have vanished again, Applied Materials is continuing to
pick-up regular small to mid-sized equipment orders from the leading
foundry.
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Samsung Electronics has adopted Nanometrics ‘UniFire’ metrology tool for
advanced wafer scale packaging after successfully completing
evaluations for development of through-silicon via (TSV) technology.
Nanometrics’ said that its UniFire system has now been adopted by five
of the top seven semiconductor manufacturers worldwide for wafer scale
packaging for advanced TSV and micro bump process control.
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Though not competing with major rivals, TSMC and Globalfoundries in the capital expenditure stakes in 2011, UMC is still placing strategic orders with equipment suppliers this year. The latest order from UMC is with Applied Materials, valued at approximately US$17.95 million.
Leading foundry, TSMC has placed a new batch of equipment purchase
orders with metrology leader, KLA-Tencor. Following-on from a US$44
million order, earlier this year, the value of the latest TSMC order is
approximately US$29.1 million.
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A major advance has been achieved in the reliability of RF MEMS
electrostatic actuators, according to CEA-Leti. The research
organisation said that its RF MEMS switch technology has reached a new
level of maturity, allowing it to provide customers with a significantly
improved manufacturing process.
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A multiyear Collaborative Development Program (CDP) and IP licensing
agreement has been signed between Globalfoundries and Intermolecular to
enable a fast-track method to develop process modules that will be
integrated into the foundry’s fabs, worldwide. Most of the development
work will be performed at Intermolecular’s HPC (High Productivity
Combinatorial) R&D Center in San Jose, California.
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