Online information source for semiconductor professionals

News > Wafer Processing

TSMC keeps spending on facilities and front-end fab equipment

20 February 2012 | Wafer Processing
Leading semiconductor foundry, TSMC has placed official orders valued at over US$300 million in the last 4-weeks, bringing the total in 2012 to approximately US$600 million. According to Applied Materials chairman and chief executive officer, Mike Splinter in conference call to discuss quarterly results, foundries were spending on leading-edge technology as they met demand for smart phone IC applications and will be a key driver of capital expenditure, notably in the first-half of 2012. Read more >>

Order Focus: Singulus receives two orders for Timaris vacuum deposition system

08 February 2012 | Wafer Processing
Singulus' Timaris systemSingulus Technologies has won two new orders for its Timaris deposition coating machine from an unnamed source. The company expects this to be the start of a good year for shipments of such tools, as nano-coating technology for MRAM wafers and thin-film read/write heads are becoming more and more popular among wafer manufacturers. Read more >>

Order Focus: Veeco ships TurboDisc MOCVD tool to LG Siltron

08 February 2012 | Wafer Processing
Veeco's TurboDiscVeeco Instruments has revealed that it has received an order for one of its TurboDisc MOCVD tools from South Korean epi wafer manufacturer, LG Siltron. The TurboDisc tool is a K465i gallium nitride MOCVD system for production of gallium nitride on silicon (GaN-on-Si) wafers for power electronics and LED devices. Read more >>

Rudolph ships first MetaPULSE system for under-bump metallization processes

07 February 2012 | Wafer Processing
MetaPULSEProcess characterization equipment supplier Rudolph Technologies has entered the back-end packaging sector of the semiconductor industry with its first shipment of its MetaPULSE metrology system. The shipment took place in Q4’11 to an unnamed customer, said to be a major IC manufacturer, and the tool has since been installed at the customer’s site. Read more >>

Tool Order: Lam Research picks-up equipment orders from TSMC and UMC

31 January 2012 | Wafer Processing
After the Chinese New-Year holidays, both leading Taiwan-based foundries, TSMC and UMC have got back to work early, placing orders with Lam Research. In-line with usual buying habits, TSMC placed the largest of the two orders worth approximately US$33.3 million. Read more >>

Tool Order: KLA-Tencor receives multiple orders from Taiwan‚??s top foundries

06 January 2012 | Wafer Processing
Both TSMC and UMC have placed purchase orders with KLA-Tencor this week, enabling the metrology and yield specialist to record bookings of almost US$70 million. Read more >>

TSMC kicks-off 2012 with equipment purchase spree

05 January 2012 | Wafer Processing
Updated. Perhaps semiconductor equipment suppliers are offering January sales like the retail trade as the largest foundry in the world; TSMC has gone on spending spree over the last few weeks. Purchase orders have been placed ASML, Applied Materials, Novellus, KLA-Tencor and Tokyo Electron (TEL) that add-up to one of its strongest capital equipment spending periods in the last 12-months. Read more >>

Equipment bookings strengthen in November

16 December 2011 | Wafer Processing
According to the November Book-to-Bill Report published by SEMI, bookings strengthened slightly from reaching a low in September and October. The three-month average of worldwide bookings in November 2011 was US$973.3 million, up 5% over the final October level of US$926.8 million but 35.7% below bookings of US$1.51 billion posted in November 2010. Read more >>

Lam acquires Novellus for US$3.3 billion

15 December 2011 | Wafer Processing
Rumours have circulated for years over the possible merger of Lam Research and Novellus Systems as there is little overlap in product portfolios. However, rumours have finally turned to reality in an all stock deal that values Novellus at US$3.3 billion. The deal is the second major acquisition within the top 10 equipment suppliers this year, following quickly on the acquisition of Varian Semiconductor by Applied Materials. Read more >>

Tool Order: UMC ends conservative year of spending with a flurry

13 December 2011 | Wafer Processing
Taiwan-based foundry, UMC has kept a tight reign on capital spending in 2011, advising in the third quarter that CapEx would be restricted to US$1.8 billion. As the year draws to an end, UMC has announced tool purchases from ASML and Tokyo Electron worth approximately US$127 million, ending the year with a spending flurry. Read more >>