Online information source for semiconductor professionals

IMEC is to use Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools for characterizing and optimizing the reliability and electrical performance of through-silicon vias (TSVs) as part of the nano-electronics research centre’s to accelerate development efforts.
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Citing strong demand across virtually all its market segments, which include semiconductor, LCD display and crystalline silicon solar, but not thin-film solar, Applied Materials expects FY2010 sales to be over 50% greater than the previous year. Applied had previously guided sales would increase by approximately 30%.
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A major foundry has selected the ‘Integra’ dry strip system from Axcelis Technologies for its most advanced production facility. The customer was claimed to have selected the Integra over competitive products because of its significant advantages in productivity, advanced process capabilities and manufacturing flexibility. Delivery times were not disclosed.
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A Tier 1 memory manufacturer has placed a US$5 million order with Rudolph Technologies for its ‘S3000A’ and ‘MetaPULSE’ III thin film metrology systems. The systems purchase order represents a capacity buy and the tools are expected to be shipped to multiple fabs in 1Q and 2Q 2010. Read more >>

Matheson Tri-Gas and Rasirc have signed an exclusive distributor agreement, in which the gas company will distribute the equipment manufacturer's purification and delivery systems for controlled humidification and ultrapure steam generation for solar and microelectronics applications throughout the United States. Read more >>

A leading chip manufacturer has placed a follow-on order with Axcelis Technologies for its Optima HDx high current implanter. Axcelis said that the customer had used the system in another fab and would now expand its adoption of the tool at its newest facility. Read more >>

A new technology development collaboration has been established between Novellus Systems, IBM and the College of Nanoscale Science and Engineering (CNSE) at CNSE’s Albany NanoTech Complex to develop advanced, residue-free photoresist strip technologies for leading-edge processes for the 28nm and 22nm nodes.
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Production partners Micron Technology and Nanya Technology had developed a 42nm DDR3 DRAM device that uses copper metalization with 2Gb density. The new 42nm process now makes 1.35-volts the standard, mainstream voltage requirement, compared to 1.5-volt with previous generations. The partners are also preparing a 3X node migration, which is being developed in R&D. Read more >>

A Major logic foundry based in Asia has placed a multiple systems follow-on order with Ultratech for its laser spike anneal (LSA) tool. Ultratech's LSA100A systems will be used to support high-volume production for advanced logic devices in 2010. Ultratech said that all major logic foundries now used this tool.
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Novellus Systems has shipped the 1000th VECTOR plasma-enhanced chemical vapor deposition (PECVD) system to Globalfoundries Singapore 300mm facility, Fab 7. The tool will be used for high-volume manufacturing at the 65nm technology node and beyond. Formerly Chartered Semiconductor, the company purchased its first VECTOR system in 2004. Introduced in July of 2000, the VECTOR system is a manufacturing workhorse used to deposit a wide range of dielectric applications in FEOL and BEOL processes. Read more >>