
Intel has strengthened its position in the wireless technology stakes by purchasing Infineon’s Wireless Solutions (WLS) business. The cash transaction, valued at approximately US$1.4 billion, will see the WLS segment operate as a standalone business for its existing customers, while also contributing to Intel’s aim of further developing its connected computing capabilities.
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Launching what has become known as the world’s highest capacity single-chip 64Gb memory, Toshiba has announced that it has begun volume production of NAND flash memories fabricated with 24nm process technology. Use of this 24nm technology will drive the further shrinkage of chip sizes, allowing the highest density on a single chip.
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After over 20 years of stasis in the pecking order of IC manufacturing revenues, it looks like Samsung’s remarkable rise in performance of late might see the company
overtake current leader Intel as soon as 2014. A combination of data from
IC Insights’ Strategic Reviews Online database of worldwide semiconductor companies and the
McClean Report 2010 Mid-Year Update’s five-year market forecasts suggest that Samsung’s current revenue growth, if maintained at its current rate, will overtake that of Intel, replacing the long-serving industry leader.
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New semiconductor equipment bookings are now at their highest levels
since the dot com boom, according to the latest book-to-bill figures
from SEMI. North America-based manufacturers of semiconductor equipment
posted US$1.83 billion in orders in July 2010 (three-month average
basis) and a book-to-bill ratio of 1.23. The bookings figure is up 5.9%
from the final June 2010 level of US$1.73 billion, and is 220.4% above
the US$571.8 million in orders posted in July 2009, SEMI said.
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A leading Asian foundry has installed a Helios XP rapid thermal
processing (RTP) system from Mattson Technology at its R&D facility.
The follow-on evaluation system expands Mattson's RTP installed base at
this foundry where the Helios XP has been established as the tool of
record and is currently being qualified for next-generation process
development, according to the company.
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Applied
Materials posted strong quarterly results that beat the analysts'
estimates, reporting net sales of US$2.52 billion, operating profit of
US$183 million, and net income of US$123 million.
Non-GAAP net income was US$234 million. However, the leading semiconductor manufacturing equipment supplier warned
that sales of solar and energy equipment would decrease from 15% to make
up 10%-20% of company revenue this quarter, due to strong Q3 results
and looming feed-in tariff cuts.
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Process yield problems are to blame for a slight delay in new
microprocessor shipments from AMD, using GlobalFoundries 32nm process,
according to Dirk Meyer, President and Chief Executive Officer of AMD.
In a conference call with financial analysts to discuss second quarter
results, 32nm devices would start shipping and generating revenue in the
fourth quarter of 2010, not in the third quarter as previously guided.
The yields were not where they expected them to be in the quarter and
meant they were unable to ramp production as planned.
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Mass metrology specialist, Metryx has seen a sharp recovery in business,
with multiple Mentor mass metrology system orders received, including
both new and repeat business, according to the company. Significantly,
the orders come from companies based around the world, including the US,
Europe and Asia.
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Two leading semiconductor foundries based in Asia have placed multiple
orders for Mattson Technology’s Suprema and Aspen 3 Strip systems. The
systems will be used for various photoresist strip processes as they
ramp their production volumes. All tools will be delivered to both
customers by the end of the current third quarter.
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A just announced angstrom-level etch system, dubbed Applied Centura
‘AdvantEdge Mesa’ from Applied Materials has seen strong demand from
customers, according to the company. Applied said that more than 60
chambers have shipped to customers in the last three months – where they
are tool-of-record for 32nm IC fabrication and 22nm process
development.
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