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Infineon sells Wireless Solutions Business to Intel for US$1.4 billion cash

31 August 2010 | Wafer Processing
Peter 
Bauer of Infineon TechnologiesIntel has strengthened its position in the wireless technology stakes by purchasing Infineon’s Wireless Solutions (WLS) business. The cash transaction, valued at approximately US$1.4 billion, will see the WLS segment operate as a standalone business for its existing customers, while also contributing to Intel’s aim of further developing its connected computing capabilities. Read more >>

Toshiba starts mass production of 24nm process NAND flash

31 August 2010 | Wafer Processing
ToshibaLaunching what has become known as the world’s highest capacity single-chip 64Gb memory, Toshiba has announced that it has begun volume production of NAND flash memories fabricated with 24nm process technology. Use of this 24nm technology will drive the further shrinkage of chip sizes, allowing the highest density on a single chip. Read more >>

Samsung eyes top spot in IC fabrication as revenues rival Intel’s

27 August 2010 | Wafer Processing
Samsung DRAMAfter over 20 years of stasis in the pecking order of IC manufacturing revenues, it looks like Samsung’s remarkable rise in performance of late might see the company overtake current leader Intel as soon as 2014. A combination of data from IC Insights’ Strategic Reviews Online database of worldwide semiconductor companies and the McClean Report 2010 Mid-Year Update’s five-year market forecasts suggest that Samsung’s current revenue growth, if maintained at its current rate, will overtake that of Intel, replacing the long-serving industry leader. Read more >>

Semiconductor equipment bookings blossom

24 August 2010 | Wafer Processing
New semiconductor equipment bookings are now at their highest levels since the dot com boom, according to the latest book-to-bill figures from SEMI. North America-based manufacturers of semiconductor equipment posted US$1.83 billion in orders in July 2010 (three-month average basis) and a book-to-bill ratio of 1.23. The bookings figure is up 5.9% from the final June 2010 level of US$1.73 billion, and is 220.4% above the US$571.8 million in orders posted in July 2009, SEMI said. Read more >>

Tool Order: Mattson’s Helios XP RTP system installed at Asia-based foundry’s R&D facility

24 August 2010 | Wafer Processing
A leading Asian foundry has installed a Helios XP rapid thermal processing (RTP) system from Mattson Technology at its R&D facility. The follow-on evaluation system expands Mattson's RTP installed base at this foundry where the Helios XP has been established as the tool of record and is currently being qualified for next-generation process development, according to the company. Read more >>

Applied Materials silicon systems group sees strong growth; Q3 results hit by thin-film PV writedown

19 August 2010 | Wafer Processing
amat_tsvApplied Materials posted strong quarterly results that beat the analysts' estimates, reporting net sales of US$2.52 billion, operating profit of US$183 million, and net income of US$123 million. Non-GAAP net income was US$234 million. However, the leading semiconductor manufacturing equipment supplier warned that sales of solar and energy equipment would decrease from 15% to make up 10%-20% of company revenue this quarter, due to strong Q3 results and looming feed-in tariff cuts. Read more >>

Yield issues dog 32nm roll-out for AMD at GlobalFoundries

Process yield problems are to blame for a slight delay in new microprocessor shipments from AMD, using GlobalFoundries 32nm process, according to Dirk Meyer, President and Chief Executive Officer of AMD. In a conference call with financial analysts to discuss second quarter results, 32nm devices would start shipping and generating revenue in the fourth quarter of 2010, not in the third quarter as previously guided. The yields were not where they expected them to be in the quarter and meant they were unable to ramp production as planned.
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Tool Order: Metryx reports improving acceptance of mass metrology for 300mm production

16 July 2010 | Wafer Processing
Mass metrology specialist, Metryx has seen a sharp recovery in business, with multiple Mentor mass metrology system orders received, including both new and repeat business, according to the company. Significantly, the orders come from companies based around the world, including the US, Europe and Asia. Read more >>

Tool Order: Foundries place multiple orders for Mattson’s strip system

13 July 2010 | Wafer Processing
Two leading semiconductor foundries based in Asia have placed multiple orders for Mattson Technology’s Suprema and Aspen 3 Strip systems. The systems will be used for various photoresist strip processes as they ramp their production volumes. All tools will be delivered to both customers by the end of the current third quarter. Read more >>

SEMICON West: Applied Materials sells 60-plus ‘AdvantEdge Mesa’ chambers

12 July 2010 | Wafer Processing
‘AdvantEdge Mesa’A just announced angstrom-level etch system, dubbed Applied Centura ‘AdvantEdge Mesa’ from Applied Materials has seen strong demand from customers, according to the company. Applied said that more than 60 chambers have shipped to customers in the last three months – where they are tool-of-record for 32nm IC fabrication and 22nm process development. Read more >>