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Rubicon Technology has started initial production of 200mm sapphire wafers under a supply contract with Peregrine Semiconductor. Rubicon has migrated to 150mm wafer production for Peregrine in 2007. The wafers will be used for Peregrine’s UltraCMOS SOS RFICs. Read more >>

The SOI Industry Consortium has welcomed NVIDIA, the fabless visual technology company, as its 23rd member. The SOI Industry Consortium, an association of companies whose aim is to promote the benefits of SOI technology, was formed in October 2007. 

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Rohm and Haas Electronic Materials’ CMP Technologies division has opened a new Asia Technical Center (ATC) in Hsinchu, Taiwan to enable CMP technology development and collaboration with Asia-based customers. The center will also provide engineering and technical support throughout the Asia-Pacific region. Read more >>

Rohm and Haas Company has entered into an agreement with The Dow Chemical Company for the acquisition by Dow of all of the outstanding shares of Rohm and Haas common stock for $78.00 per share in cash. Taking into account the approximately 196 million shares held by Rohm and Haas as of April 22nd 2008, the estimated transaction price is over $15 billion. Read more >>

NexPlanar Corporation has announced its completion of a $14.5 million round of financing that will enable them to market and commercialize its new CMP pad technology. The company uses proprietary "nano-domain" technology, which, according to the company, improves planarity, across-wafer uniformity and the most advanced CMP applications. Read more >>

In an attempt to meet the increasing demand for high-purity silane gas in the PV and related industries, the Linde Group and Schmid Silicon Pilot Production have decided to collaborate on silane production via the joint ownership of a new facility in Dresden, Germany. The silane produced at this facility will contribute towards the current capacity for Linde’s customers and will be based on the new Schmid Monosilane Technology process. Read more >>

Evonik Industries AG and BASF have announced a joint development program for next-generation CMP slurries, targeting shallow trench isolation (STI) and inter-layer dielectric (ILD) processes. Evonik is to provide various grades of cerium oxide to be used with BASF’s slurry chemistry. Read more >>

Siltronic Samsung Wafer Pte. Ltd., the joint venture of Samsung Electronics Co. Ltd. and Siltronic AG, has begun 300mm wafer production at a newly commissioned US$1 billion facility in Singapore. The JV, which was completed in 18 months, is expected to produce 300,000 wafers and to generate over 800 jobs by 2010. Read more >>

Hynix Semiconductor has expanded bulk gas supply contracts with Air Liquide Electronics at its new 300mm fab located in Cheongju, South Korea and its joint venture 300mm fab in Wuxi, China. Read more >>

Voltaix LLC has announced that due to increased demand for germane from both the semiconductor and solar industries, it plans to expand production of the compound. The expansion will include the completion of the installation of a previously constructed skid-mounted site, the location of which was not disclosed by the company. Read more >>