
Carl Zeiss SMT, has given its 2008 supplier award to M+W Zander Products for its specialist minienvironment systems used in mask repair and mask inspection systems. All suppliers were evaluated based on a various criteria, including quality, technology, logistics and pricing.
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A new development partnership has been formed by Rite Track and Brewer Science to work on enhancing the performance of legacy track systems from TEL and SVG. Continued refinements of the platforms by Rite Track for customers will now have new process technologies offered by Brewer Science to extend track systems life-span in the field.
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The Fraunhofer Institute for Applied Optics and Precision Engineering IOF, has selected EVG's UV-based nanoimprint lithography (UV-NIL) step and repeat system for its leading-edge optoelectronic research efforts. The Institute will be using the UV-NIL stepper for micro-lens mastering and molding for a host of micro-optics applications, including fiber optics and CMOS image sensors for wafer-level cameras.
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Benchmark demonstrations at one of Toshiba’s 300mm fabs has verified that the newly launched ‘SOKUDO DUO’ coat/develop track platform has been able to process 300mm wafers at 300wph. The new productivity level is claimed to be a significant improvement over previous track systems with traditionally 200wph throughput levels.
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Lithography tool sales at Canon have declined further, due to lack of demand specifically from the memory manufacturing sector, the company said. Canon sold only four lithography tools in the first quarter of 2009, none were leading-edge 193nm ArF systems.
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Tokyo Ohka Kogyo Co., Ltd. (TOK) has joined SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany to develop 22nm and below photoresists for extreme ultraviolet (EUV) lithography.
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The semiconductor photomask market is estimated to be US$2.9 billion in 2008 and forecasted to contract to US$2.5 billion in 2009, according to a new report available from SEMI. However, a recovery in demand is expected to see the photomask market return to growth in 2011, reaching US$2.7 billion.
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Fully functional 22nm CMOS SRAM cells of 0.099µm² density have been fabricated at IMEC using ASML’s EUV Alpha Demo Tool (ADT). The new cells are 47% smaller than IMEC’s 0.186µm² cell produced at the 32nm node last year. The results were presented during IMEC’s partner review week.
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Having licensed Micronic Laser Systems spatial light modulator and data-path technology used in optical maskless lithography in late 2004, ASML has dropped the project, according to Micronic Laser. As a result, Micronic Laser is repaying royalty advancements made by ASML to the tune of €13 million, the company said. The original deal included a prepayment of €20 million.
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The collapse in capital equipment spending in the first quarter of 2009 impacted ASML’s lithography sales to the extent that it only shipped one immersion tool in the first quarter of 2009. The company reported its lowest quarterly sales in nearly a decade, generating €184 million. Sales in the fourth quarter of 2008 totalled €494 million a fall of approximately 62%. ASML made a loss of €117 million as well as de-booking 4 lithography ‘dry’ tools from its backlog, worth €56 million.
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