
SEMATECH has accepted Veeco Instruments' ‘InSight’ 3D Atomic Force Microscope for non-destructive reference metrology for critical dimension (CD), overlay and contour, as well as 3D characterization of EUVL resist features. SEMATECH’s Metrology Program is located at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex.
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A more purposeful and deliberate move by TSMC to push the semiconductor industry towards the adoption of e-beam technology for volume production was made with a new technology development agreement with CEA-Leti. The French semiconductor research institute is to work with TSMC to push Dutch firm Mappper Lithography’s multi-beam maskless technology into the mainstream. The three-year program includes tool assessment, patterning and process integration, data handling, prototyping and cost analysis.
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Dai Nippon Printing (DNP), producer of semiconductor photomasks, and Molecular Imprints, producer of nanopatterning systems and solutions, are collaborating to speed production of nanoimprint lithography for high-volume semiconductor device manufacturing. DNP is the official provider of funds and support for Molecular Imprints to develop a new mask replication platform aimed at lowering the cost of imprint masks.
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To maximise yield and limit IC design costs, TSMC is providing access to its tool chain and process models for its 28nm process, in an effort to help designers limit hotspot correction work for lithography limitations. This is a move away from abstracted models, which at these geometries lose information in the translation process, forcing designers to overcompensate for lithography hotspots that take time and increase surface area.
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Applied Materials has said that it is significantly reducing its involvement in joint venture lithography track equipment supplier Sokudo. Applied has revised its ownership position with partner Dainippon Screen from a 48% interest when the venture was established in mid-2006, to a 19% stake. Tokyo Electron has been the dominant track supplier for 300mm lithography tools.
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Stepper tool unit sales could fall to only 118 in 2009, according Gartner semiconductor equipment analyst Klaus Rinnen, in Gartner’s weekly newsletter to clients. This would equate to a 54% decline compared to 2008, when stepper unit sales totalled 344. This was also a significant decline from 2007, when unit sales reached 604. Stepper sales included semiconductor and LCD markets.
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Chartered Semiconductor Manufacturing has purchased a reticle haze removal tool, ‘Rhazer’ from Rave LLC. The Singapore based foundry had been evaluating the tool since the beginning of the year. The system will be used in Chartered 300mm facility, Fab 7 and is expected to reduce time and produce cost savings to its photomask clean and control program.
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A new innovative photomask pellicle removal tool designed by HAP GmbH of Dresden, Germany is to be exclusively sold and distributed by Carl Zeiss SMT. HAP is semiconductor automation, sub-systems and tool assembly outsourcing company that has worked with Zeiss on other equipment.
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D2S, e-Shuttle, and Fujitsu Microelectronics, all steering group
members of the eBeam Initiative, say they have validated the design for
electron beam (DFEB) methodology for low-volume, 65-nm system-on-chip
applications, without sacrificing performance, area, or power.
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As it continues to preserve cash, loss making photomask manufacturer, Photronics has been able to renegotiate the lease agreement at its joint venture mask shop with Micron Technology. The new operating lease agreement for the NanoFab facility will be reduced from US$3.8 million to US$2.0 million per quarter, and the lease term will be extended from December 31, 2012 to December 31, 2014. Photronic said that the outstanding debt and assets associated with the facility will be reduced by approximately US$30 million.
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