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Foundry leader, TSMC has placed an equipment purchase order with ASML worth US$76.447 million on the day the foundry reported capital expenditure plans of US$7.8 billion for 2011. TSMC had noted that it had spent US$1.5 billion on CapEx in the fourth quarter and total CapEx in 2010 of US$5.94 billion. Read more >>

The newly formed Nanotechnology and Application Center (SUNAC) of the Sabanci University based in Istanbul has purchased an EBPG5000plusES e-beam lithography tool from Vistec Lithography. The Gaussian Beam system will be used for nanotechnology research with other institutions. Read more >>

With well over 70% market share, lithography leader, ASML (NASDAQ:ASML) (Amsterdam:ASML) has eyed the latest phase of 300mm fab constructions as a potential revenue stream of over €7 billion through 2012, specifically from lithography tool related spending. According to only officially announced (13) new 300mm fabs, ASML noted that €1.5 billion could be spent on lithography tools from the DRAM sector, €2 billion from NAND flash and €3.5 billion from the IDM and foundry sectors combined.
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CEA-Leti has attracted TOK to join its ‘IMAGINE’ E-beam lithography program to develop maskless photoresists beyond the 20nm node. The multiple e-beam-lithography program at CEA-Leti covers a global approach to the technology, including tool assessment, patterning and process integration, data handling, prototyping and cost analysis and is known for its fundamental RLS (resolution, line edge roughness and sensitivity) development work. Read more >>

A new agreement between photomask manufacturer, Toppan Printing and IBM will see a collaboration that started at the 45nm node in 2005, extended through 2012 to cover required processes and technologies at the 14nm node. The development work will take place at IBM’s photomask facility in Essex Junction, VT, and Toppan’s Asaka photomask facility in Niiza, Saitama, Japan. Read more >>

SUSS MicroTec expects order entry for the fourth quarter of 2010 to total about €50 million, which is significantly higher than guidance of more than €30 million, previously given. Read more >>

Japanese chemical, Nissan Chemical has joined SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. The company will collaborate with SEMATECH engineers on advanced adhesion enhancing materials in extreme ultraviolet (EUV) lithography such as edge roughness (LER), elimination of pattern collapse in images below 22 nm, and ultimate resolution of new resists. Read more >>

Lithography tool supplier, ASML is increasing its booking guidance for the fourth quarter of 2010 as new 300mm fab projects drive increased demand and the fall-off of demand from DRAM manufacturers was les than expected. Fourth quarter system order intake is said to be above €2 billion, compared to previous guidance of €1.3 billion. Read more >>

According to Toppan Photomasks it was one of only two companies recognized in all categories at TowerJazz Supplier Day. TowerJazz utilizes a comprehensive Supplier Rating Program to measure quality, commercial performance, cycle time, technology, capability and customer support.
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A collaboration to support Carl Zeiss’ photomask tool family for in–die metrology solutions for the 32nm node and below has begun with Synopsys. Using Synopsys’ CATS as the data preparation engine, mask engineers using Zeiss’ PROVE system are expected to benefit from improved efficiency and usability of a registration metrology system, specifically in overlay accuracy requirements. Read more >>