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Continuing its long-term lithography technology partnership, TSMC is to take delivery of a TWINSCAN NXE:3100 EUV lithography system from ASML. Although pricing and delivery dates were not disclosed, TSMC said it would you the system for future advanced process node development, which is being conducted at its Fab 12 facility. ASML has now secured six customers for its EUV R&D tool. First shipments to some its customers could start in 2010. TSMC is also pursing e-beam lithography for future nodes, due to the inherent costs associated with EUV technology. A volume production EUV tool could cost in excess of US$50 million, according to market research firms. Read more >>

Toshiba’s Device Process Development Center in Japan, has had its Molecular Imprints ‘Imprio’ 250 System upgraded to offer better mix and match overlay performance for 20nm full field resolution R&D device development. The system also has better wafer automation handling. Read more >>

Dow Electronic Materials has partnered with SEMATECH’s Resist Materials and Development Center at UAlbany NanoCollege, Albany, NY to advance the development of next-generation extreme ultra-violet lithography (EUVL) materials and resists for use at the 22nm node and beyond. Read more >>

The purchase of 90-S Series SVG tracks from the closed NXP Fishkill fab has meant that Rite Track can now offer a continued line of replacement parts for the platform. Integration of this inventory began late last year and is now available to Rite Track customers, apparently with significant savings, according to the company. Read more >>

Hamamatsu Photonics has placed an order for an Obducat NIL system through its sales partner in Japan, Canon Marketing Japan. The NIL system will be used in product development and pilot production of new optical devices. Obducat said that Hamamatsu based their selection on imprint quality, the industrial track record of Obducat and the strong local support from Canon. Read more >>

ASML has joined SEMATECH’s Lithography program at the College of  Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex to further develop EUV lithography to ensure its future adoption. ASML already partners with IMEC on EUV technology and infrastructure development. CNSE also has an ASML built EUV ‘Alpha’ tool. Read more >>

The Advanced Mask Technology Center (AMTC), which was originally, established as a joint venture between AMD, Infineon and DuPont Photomasks but was later acquired with the facility by Toppan Photomasks will now be used as a mask shop for Globalfoundries facilities in Dresden and Singapore. A new joint venture for the facility has been formed with TPI, which will see the facility combined into one operation, while TPI will retain its Dresden sales, customer service and mask front-end functions. Read more >>

STMicroelectronics has joined the CEA-Leti IMAGINE program, which is attempting to develop and asses the maskless lithography technology from MAPPER Technology. The three-year project also has TSMC as a partner. STMicroelectronics noted that after many years of using e-beam lithography for IC prototyping, joining the IMAGINE project was a logical move to find possible next-generation lithography solutions. TSMC has previously been critical of EUV costs and has actively supported e-beam development for volume production applications. Read more >>

Vistec Electron Beam has shipped a 50kV Variable Shaped Beam system for photomask production to the Moscow Institute of Electronic Technology (MIET). The e-beam system is equipped with a fully automated substrate handling and is prepared to expose different substrate types and sizes. Read more >>

STMicroelectronics has extended its DFM collaboration with ASML and Brion to include the deployment at the 28nm node and 22nm node development. The joint development project has been code-named SOLID (Silicon printing Optimization with Lithography control and Integrated Design). The project is also intended to accelerate time to market for ST. Read more >>