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SUSS MicroTec expects order entry for the fourth quarter of 2010 to total about €50 million, which is significantly higher than guidance of more than €30 million, previously given. Read more >>

Japanese chemical, Nissan Chemical has joined SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. The company will collaborate with SEMATECH engineers on advanced adhesion enhancing materials in extreme ultraviolet (EUV) lithography such as edge roughness (LER), elimination of pattern collapse in images below 22 nm, and ultimate resolution of new resists. Read more >>

Lithography tool supplier, ASML is increasing its booking guidance for the fourth quarter of 2010 as new 300mm fab projects drive increased demand and the fall-off of demand from DRAM manufacturers was les than expected. Fourth quarter system order intake is said to be above €2 billion, compared to previous guidance of €1.3 billion. Read more >>

According to Toppan Photomasks it was one of only two companies recognized in all categories at TowerJazz Supplier Day. TowerJazz utilizes a comprehensive Supplier Rating Program to measure quality, commercial performance, cycle time, technology, capability and customer support.
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A collaboration to support Carl Zeiss’ photomask tool family for in–die metrology solutions for the 32nm node and below has begun with Synopsys. Using Synopsys’ CATS as the data preparation engine, mask engineers using Zeiss’ PROVE system are expected to benefit from improved efficiency and usability of a registration metrology system, specifically in overlay accuracy requirements. Read more >>

Lithography track specialist, SOKUDO has joined the new industry and research multi-partner program IMAGINE run by CEA-Leti that is developing maskless lithography for IC manufacturing. Under a three-year project partners such as TSMC and STMicroelectronics are working to potentially bring maskless lithography developed by MAPPER Lithography into the mainstream. Read more >>

Toppan’s ongoing joint development project with IBM has led to the mask manufacturer claiming it is now ready to support 22nm and 20nm photomask prototyping as well as production for leading-edge semiconductor manufacturing customers. The latest photomask technology accommodates advanced double patterning and source mask optimization (SMO) solutions to extend the capabilities of 193nm wavelength ArF immersion optical lithography, without associated significant increases in mask costs, according to Toppan. Read more >>

Veeco Instruments has revealed the completion of the sale of its Metrology business unit to Bruker, provider of high-performance solutions and scientific instruments for molecular and materials research. The US$229 million cash transaction has been approved by both companies’ boards of directors, and will involve the transfer of Veeco’s global business – including its atomic force microscope (AFM) business in Santa Barbara, CA and its optical industrial metrology (OIM) business in Tucson, AZ – to Bruker, which will combine the new acquisition with its existing Bruker Nano instruments business. Read more >>

The jointly developed ‘PROVE’ overlay metrology system between Carl Zeiss and SEMATECH has successfully passed a key development milestone, according to the partners. The system has achieved .5nm repeatability and 1.0nm accuracy in image placement, registration and overlay measurement for double patterning photomasks, a key requirement for extending 193nm ArF lithography to the 32nm node and below. Read more >>

In another aggressive move to push ahead of its foundry competitors, GlobalFoundries is side-stepping the purchase of pre-production EUV tools and moving directly to production tool sets at Fab 8 in upstate New York, according to Gregg Bartlett, Senior Vice President of Technology and R&D at the foundry, during a keynote address at SEMICON West. The EUV tool, expected to be supplied by ASML will be installed in the second half of 2012, Bartlett said. Read more >>