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Nova’s 3090Next CD metrology system integrated into Sokudo’s RF3 track system
27 February 2008 | Lithography
Nova Measuring Instruments’ optical critical dimension (CD) metrology
platform has been qualified on Sokudo's RF3 coat/develop track systems,
the companies have said. The NovaScan 3090Next is an advanced metrology
platform for Optical CD Control and shape-profiling, implementing
polarized normal incidence spectroscopic scatterometry.
AMD and IBM successfully produce first EUV ‘full-field’ test chip
27 February 2008 | Lithography
AMD and IBM have said they have successfully produced a working test
chip utilizing “full-field” EUV lithography for the critical first
layer - instead of ‘narrow field’ (R&D sample applications) - in
the fabrication process across an entire 22mm x 33mm AMD 45nm node test
chip.
Read more >>Tool Order: Gigaphoton ships first GT62A 90W laser
27 February 2008 | Lithography
Gigaphoton has shipped the first of its new GT62A ArF 90W laser light
sources to a lithography equipment company that is designed for
double-patterning immersion lithography.
Read more >>Tool Order: SEMATECH buys Imprio 300 imprint lithography tool from Molecular Imprints
27 February 2008 | Lithography
SEMATECH has purchased an Imprio 300 imprint lithography tool from
Molecular Imprints, Inc. (MII) to evaluate the use of the technology
for a variety of real-world applications at the 32nm node and below.
The collaborative partnership’s initial goal is to demonstrate and
enhance overlay performance. The Imprio 300 will be delivered to
SEMATECH at the College of Nanoscale Science and Engineering (CNSE) of
the University at Albany in mid-2008.
Read more >>IBM taps Rohm and Haas for implant and lithography materials development
25 February 2008 | Lithography
Rohm and Haas Electronic Materials and IBM have entered into a joint
development agreement to create patterning materials and processes to
enable implant steps at the 32nm node and beyond.
Read more >>Spansion to use Sokudo’s RF3S track for 32nm immersion development
21 February 2008 | Lithography
Spansion will use Sokudo's RF3S immersion track system at its 300mm
Submicron Development Center (SDC) in Sunnyvale, CA to develop 193nm
immersion processes for its 32nm flash devices.
Read more >>New Product: Invarium offers ‘wet’ versus ‘dry’ lithography patterning synthesis trade-offs:
18 September 2006 | Lithography
Product Briefing Outline: Invarium has launched
‘Dimension45/32' design to manufacturing synthesis tools to
specifically address patterning challenges at the 45 and 32nm nodes.
Dimension45/32 is designed to enable lithography and photomask
synthesis teams to select and optimize the right combination of
exposure strategies and full-chip photomask layout synthesis. It also
enables layout retargeting, if necessary, to achieve the best post-etch
results on silicon, with, according to the company, the largest process
window and best yield. Dimension45/32 is currently being
customer-qualified in North America, and the company has stated that a
second customer qualification program will immediately commence in Asia.
Read more >>