Online information source for semiconductor professionals

Elpida Memory has said that it has used 193nm ArF immersion lithography and copper interconnect technology for the development of its 50nm DDR3 SDRAM semiconductors. Volume production is scheduled to begin in the January-March 2009 quarter, the company said. Read more >>

Nikon is to release a new double patterning (DP) specific 193nm ArF immersion scanner by the end of 2009, the company has announced. The NSR-S620 ArF immersion scanner has been improved to handle higher wafer throughput to tackle the cost impediment of double the number of exposures. Read more >>

ASML Holding NV has set a productivity record with its TWINSCAN platform of lithography systems. To date, the company has 76 TWINSCAN systems that have processed more than one million wafers in a 12-month period. Read more >>

Cymer said it will reduce its worldwide workforce by approximately 8 percent, or 85 total employees, which are in addition to a range of cost saving measures previously in place as the severity of the semiconductor downturn becomes clearer. Read more >>

Brion Technologies is teaming up with NuFlare Technology, Inc. to design and develop new manufacturing technologies for next-generation semiconductor masks. Brion is using its Tachyon technology in order to look and tackle the challenges of mask equipment technology of the 32nm process node and beyond; NuFlare will then market the new products. Read more >>

Nikon has revised downwards its projected sales of lithography tools for its current financial year, citing the reduction in capital equipment spending by semiconductor manufacturers. Nikon now expects to sell 74 lithography tools compared to 96, previously projected, a 30 percent reduction. Read more >>

Photronics has said it will close its Manchester, UK photomask manufacturing facility in an effort to reduce operating costs as the company is not profitable. The Company plans to maintain a customer support and data preparation center in Manchester, while customers mask requirements are transferred to other facilities, including its most advanced mask shop in Boise, Idaho. Photronics estimates that approximately 85 employees will be affected by the planned closure. Read more >>

At the seventh EUVL Symposium, organized by SEMATECH, key challenges remain for EUV lithography before volume production adoption at the 22nm half-pitch, according to attendees and an assessment from the research consortium. Read more >>

Taiwan Semiconductor Manufacturing Company (TSMC) is the first IC manufacturer to place an order with MAPPER Lithography for its 300mm multiple e-beam maskless lithography tool. TSMC will use the tool for further development in-house of the lithography technology as well as device prototyping. MAPPER said that TSMC was evaluating the technology as an option for lithography process steps at the 22nm node. Read more >>

EV Group (EVG) has reached a new milestone with the shipping of its 100th nanoimprint lithography (NIL) system. According to the company, this solidifies its 30 percent market share and leadership in the field. Read more >>