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TSMC hosts 2008 Green Forum on ‘green’ factories

31 October 2008 | EHS
TSMC Fab 14Concern for the environment and sustainability is forefront on the priority list for TSMC, as it hosted its “2008 Green Forum – The Present and Future of Green Factories” recently. The company stressed the importance of information sharing in the industry to ensure ‘green’ awareness in all aspects of operations within the industry, with a particular emphasis on building fabs that encompass conscientious manufacturing and R&D practices. Read more >>

AMD launches its eighth annual Global Climate Protection Plan

29 October 2008 | EHS
AMD unveiled its eighth annual Global Climate Protection Plan (GCPP) that summarized the company’s continuing strategy and goals to maximize energy efficiency, help lower costs and minimize its environmental impact. This year, the GCPP increased its reporting levels to include analysis and data on new initiatives and projects. It also lays out how AMD has once again committed to reduce its normalized greenhouse gas emissions by 33 percent and normalize energy usage by 40 percent by 2010, relative to a 2006 baseline year. The company surpassed its commitment for 2002-2007 to reduce normalized greenhouse gas emissions in its operations by 40 percent and normalized energy usage by 30 percent. Read more >>

ISMI rewards Applied Materials & TEL for tool energy reduction

21 October 2008 | EHS
AMAT RTP toolISMI has presented plaques to Applied Materials & TEL in recognition of their work to reduce energy consumption of their processing tools. Satoshi Saito, Director EHS, TEL and Dr. Stanley Hughes, Product Safety Director at Applied Materials, received the plaques after the Equipment Energy and Utility Reduction Workshop sponsored by ISMI, which is being held in conjunction with ISMI Manufacturing Week in Austin, Texas. Read more >>

Texas Instruments and Matros Technologies win EPA’s Clean Air Excellence Award

03 July 2008 | EHS
TexasTexas Instruments has been recognized by the U.S. EPA for accomplishments in improving air quality and reducing greenhouse gas emissions. There were 11 winners of EPA’s Clean Air Excellence Awards, which included TI. Read more >>

Richard Templeton receives 2007 SEMI Akira Inoue award

03 February 2008 | EHS
R. TempletonTexas Instruments’ CEO and President Richard Templeton (pictured) has been named as the recipient of the 2007 SEMI Akira Inoue award for excellence in environmental, health and safety standards. The Akira Inoue award is named after the late past President of TEL, who implemented collaboration on EHS development in the semiconductor industry. Read more >>

Intel to become biggest user of renewable energy in the U.S.

28 January 2008 | EHS | Comments (1)
IntelAccording to the U.S. Environmental Protection Agency (EPA), Intel Corporation is to become the top corporate purchaser of green power in the United States after the purchase of 1.3 billion kilowatt hours a year of renewable energy certificates (RECs), a trasnsaction that is being handled by Sterling Planet.  Read more >>

“Green Electronics” push for ISSCC’s event

25 January 2008 | EHS
ISSCCA special evening discussion hosted by the International Solid-State Circuits Conference (ISSCC) will see “green” electronics manufacturing issues at the fore. Taking place in the San Francisco Marriott Hotel on February 3rd, the event will be co-chaired by AMI Semiconductor’s Jan Sevenhans and Infineon’s Rudolf Koch. Read more >>

UMC gains environmental honors from ACGA

18 December 2007 | EHS
UMCIn the Clean & Green (C&G) Watch 2007 report conducted by the Asian Corporate Governance Association (ACGA) and CLSA Limited, Taiwan based foundry, UMC was ranked second overall out of 73 companies from Taiwan and third among the 336 companies surveyed in Asia. The survey ranks environmental awareness of major Asian enterprises. Read more >>

Intel’s Ocotillo campus gains EPA water efficiency award

05 December 2007 | EHS
IntelIntel’s Ocotillo manufacturing and development Campus in Chandler, Arizona has won an award from the U.S. EPA regarding water reduction and recycling strategies. The Water Efficiency Leader (WEL) awards promote the efficient use of our water resources across America. Read more >>

IBM reduces wafer reclaim costs with new process

01 November 2007 | EHS
IBMEngineers at IBM’s Burlington, Vermont semiconductor facility have developed and introduced a novel process for pattern removal on wafers that significantly reduces the process costs and environmental waste. The new process is also currently being implemented at IBM's East Fishkill facility. Read more >>