Online information source for semiconductor professionals

FEI company, a high-resolution imaging and analysis systems producer, published that King Abdullah University of Science and Technology (KAUST), in Saudi Arabia, has ordered numerous of the company’s systems as part of KAUST’s plan to build a world-class, international, graduate-level research university which will focus on stimulating advancements in scientific achievement. The order from the University includes Titan and Titan Krios transmission electron microscopes (TEMs), a Helios DualBeam, various mid-range products, and a complete support package to ensure the University’s success in its endeavor. Read more >>

Toshiba and SanDisk have agreed to a shift in NAND flash equipment ownership at Fab 3 and Fab 4 at Toshiba’s Yokkaichi manufacturing complex in Japan. The JV partners have historically shared the equal production capacity and tool ownership at these fabs, however, Toshiba will now be the sole owner of approximately 30 percent of the total production capacity at the two 300m fabs with the Flash Partners and Flash Alliance JV subsidiaries retaining a 70 percent share. Both JV subsidiaries are equally owned by SanDisk and Toshiba. Read more >>

With the purchase of Qimonda AGs 35.6 percent ownership stake in Inotera Memories for $400 million, Micron Technology has acquired access to 50 percent of Inotera’s 120,000wspm (wafer starts per month) DRAM memory capacity from two 300mm fabs based in Taiwan. The purchase will also see Micron transfer its Stack DRAM process technology to Inotera as part of the deal with Nanya, Inotera’s other major share holder. Read more >>

Continued over capacity in NAND flash production coupled to slowing demand has forced ASPs to fall below production costs, especially for production of NAND on 200mm wafers. Micron Technology has followed the lead set by Hynix Semiconductor last month in announcing a 200mm fab closure. Micron said that its Boise facility will close with the loss of jobs. The closure will also result in approximately 35,000 wafers (200mm) per month reduction in capacity. The restructuring will also see a reduction in its workforce of 15 percent, carried out over a two year period. Read more >>

With AMD going fabless with the spin-off of its semiconductor manufacturing arm into a newly formed foundry enterprise, its current foundry partners, TSMC and UMC will lose its graphic chips business to the ‘Foundry Company.’ Read more >>

X-FAB UK Ltd., the semiconductor manufacturer, has announced that it has cut its annual energy costs by over £30,000 following the installation of six 37kW ABB HVAC drives on its three cooling towers. The installation of the ABB drives by Drive Control, the local ABB HVAC partner, cost £15,000, according to the company, all of which will be recouped by the company in the space of six months. Read more >>

Hynix Semiconductor has sold a further share in its 300mm fab in Wuxi, China to Numonyx for approximately $100 million. Hynix’s stake in the fab will now fall to 72.3 percent, compared to 83.3 percent previously. The deal should be completed by year-end. Read more >>

Renesas Technology has said that its aging 150mm fab in Landshut, Germany, used to fabricate microcontrollers for smart card applications, is to be sold to two of its managers and will be turned into an analog mixed signal foundry operation. Silicon Foundry Holding (SFH) will take over the fab and will be operated by former Renesas managers Michael Lehnert and Gerhard Spitzlsperger. The transaction is expected to be completed by the end of 2008. Read more >>

Hynix Semiconductor is escalating its closure of 200mm fabs that have been producing both DRAM and NAND flash memory devises in an effort to significantly reduce output on uncompetitive 200mm wafers, while shifting production to 300mm fabs. Hynix expects the move will reduce overall production of DRAM by 20 percent and NAND flash by as much as 40 percent. Read more >>

NXP Semiconductors has said that it is undertaking a major restructuring program that will see the closure of four fabs, while consolidating production in three others. The fabs to be closed outright include Fishkill, New York, ‘ICN5’ part of a fab facility complex in Nijmegen and its ‘ICH’ fab at its Hamburg complex. NXP’s fab in Caen, France will be put up for sale, though failure to find a buyer will see the fab shuttered with the other fabs in 2009, the company said. Globally, the restructuring is expected to affect 4,500 employees in manufacturing, R&D and support functions, though the biggest impact is expected to be in The Netherlands and Germany. Read more >>