Online information source for semiconductor professionals

Yield issues dog 32nm roll-out for AMD at GlobalFoundries

16 July 2010 | By Mark Osborne | News > Wafer Processing

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

TSMC hosts 2008 Green Forum on ‚??green‚?? factories - 31 October 2008

Process yield problems are to blame for a slight delay in new microprocessor shipments from AMD, using GlobalFoundries 32nm process, according to Dirk Meyer, President and Chief Executive Officer of AMD. In a conference call with financial analysts to discuss second quarter results, 32nm devices would start shipping and generating revenue in the fourth quarter of 2010, not in the third quarter as previously guided. The yields were not where they expected them to be in the quarter and meant they were unable to ramp production as planned.

Although exact details of the yield issues were not disclosed, executives reiterated that they were confident that improvements in the yield curve were ongoing and noted that the shift to 32nm was a very difficult transition.

AMD is continuing to use an SOI substrate but with High-k/Metal Gate for the first time.

Dirk Meyer, President and Chief Executive Officer of AMD“However, in reaction to Ontario’s market opportunities and a slower than anticipated progress of 32nm yield curve, we are switching the timing of the Ontario and Llano production ramps, noted Meyer in the call. “Llano production shipments are still expected to occur in the first half of next year. In the second quarter this year we also taped out the first 32nm product based on our new high performance Bulldozer CPU core.

AMD also noted that utilization rates at GlobalFoundries were increasing after a slow start to the year and would continue to improve in the third quarter, suggesting process yield tweaks were working as 32nm products begin sustained ramping.

Related articles

Globalfoundries to start 28nm shuttle service in Q1 2010 - 30 September 2009

T-RAM and GLOBALFOUNDRIES team on embedded Thyristor-RAM - 19 May 2009

Ramping up to DFM: design for manufacture - 01 December 2003

High-k/metal gate materials and processes for 32nm technology - 01 December 2007

AMD capacity constrained at TSMC - 22 January 2010

Reader comments

Global foundries does not even know what tools to use for metrology inspection to find key killer defects in key inspection modeules. I wonder how they survived so far and I hope they get back on track with some help from Chartered semiconductor.
By F H Y S on 11 August 2010

Post your comment

Name:
Email:
Please enter the word you see in the image below: