Online information source for semiconductor professionals

Xilinx selects Samsung Electronics as 45nm foundry partner

03 February 2009 | By Mark Osborne | News > Wafer Processing

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Samsung Electronics has landed a major new foundry customer in the form of FPGA fabless company, Xilinx. Samsung will fabricate 45nm FPGA devices for Xilinx at its 300mm logic fab, S1, which is home to Samsung’s advanced foundry operations. Xilinx said in a recent conference call that 45nm devices would be available from March quarter 2009 onwards. Xilinx has been a major customer of UMC for many years and indicates that there is growing competition for the major foundries for leading-edge production, at a time when utilization rates are expected to reach record lows in the coming months.

“As a supplier of Common Platform and a recognized leader with a proven high-volume, low-power advanced process, we’re glad to have Samsung on board as a foundry partner,” said Vincent Tong, Senior Vice President, Worldwide Quality & New Product Introductions at Xilinx. “By working closely with Samsung, we are able to leverage their aggressive deep sub-micron process roadmap and continued investment in the most advanced manufacturing facilities.”

“Samsung is committed to delivering world class technology, manufacturing, and foundry services required to support Xilinx’s leadership FPGA products,” commented Dr. Ben Suh, Vice President of ASIC/Foundry Business Development, System LSI division, Samsung Electronics.

Toshiba has also been a foundry partner of Xilinx.

Related articles

Samsung Electronics to spend on PFC and SF6 reduction technologies - 21 July 2009

Xilinx looks to restructuring - 16 April 2009

Tool Order: Samsung‚??s SAIT to use Veeco‚??s MOCVD system for GaN-Based power IC R&D - 04 March 2011

Siltronic and Samsung JV starts 300mm wafer production in new Singapore facility - 19 June 2008

Samsung announces appointment of Chang-Soo Choi as President and CEO - 26 January 2009

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: