Online information source for semiconductor professionals

UMC makes Axcelis stripper “tool of record”

17 October 2005 | By Syanne Olson | News > Wafer Processing

Popular articles

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008

Applied Materials sees higher CapEx spending for 2009 - 15 August 2008

Micron close to Inotera share purchase, says Gartner - 06 October 2008

Taiwan foundry UMC has put in a follow-on order for Axcelis Technologies' RadiantStrip 320Lk photoresist dry strip and cleaning system. The RadiantStrip 320Lk system has become UMC's "process tool of record". The system will ship to UMC's Fab 12A in Tainan, Taiwan, by the end of 2005.


The system is designed to remove resist and residue without damaging sensitive low-k dielectric structures down to the 45nm technology node using a patented zero-damage He:H(2) process. Axcelis claims that this process does not introduce such "latent" damage in low-k materials that typically leads to adverse changes in a dielectric's insulating properties and physical characteristics.

By Dr Mike Cooke

Related jobs

Total Product Support - Applied Materials - Alzenau, 17 March 2008

Sales Manager - Applied Materials - Zuzhou, 17 March 2008

Manufacturing Engineer - Applied Materials - Xi'An, 04 March 2008

Technical Support Engineer - Applied Materials - Xi\'An, 22 February 2008

TPS Engineer - Applied Materials - Xi\'An, 21 February 2008

Related articles

Axcelis rejects second offer from Sumitomo - 17 March 2008

Axcelis and SHI to start merger talks - 06 June 2008

Sumitomo fails to make offer for Axcelis - 17 September 2008

Sumitomo increases price and makes further bid for Axcelis - 10 March 2008

Tool Orders: AMD repeats implant order with Axcelis - 28 September 2005

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: