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UMC makes Axcelis stripper “tool of record”

17 October 2005 | By Syanne Olson | News > Wafer Processing

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Taiwan foundry UMC has put in a follow-on order for Axcelis Technologies' RadiantStrip 320Lk photoresist dry strip and cleaning system. The RadiantStrip 320Lk system has become UMC's "process tool of record". The system will ship to UMC's Fab 12A in Tainan, Taiwan, by the end of 2005.


The system is designed to remove resist and residue without damaging sensitive low-k dielectric structures down to the 45nm technology node using a patented zero-damage He:H(2) process. Axcelis claims that this process does not introduce such "latent" damage in low-k materials that typically leads to adverse changes in a dielectric's insulating properties and physical characteristics.

By Dr Mike Cooke

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