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UMC establishes 22nm node R&D partnership with SEMATECH

28 July 2008 | By Mark Osborne | News > Wafer Processing

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UMCUMC has joined the SEMATECH research consortium to partner on 22nm-and-below process technologies. UMC previously partnered with SEMATECH’s former subsidiary, ATDF, in 2006 that saw the companies carry out pre-production work on 45nm and 32nm technologies such as dual work function metal gates, and mobility enhancement structures.

“Partnering with SEMATECH is a win-win situation for both organizations,” said Dr. Shih Wei Sun (pictured), CEO of UMC. “The combination of UMC’s 300mm manufacturing experience and process technology expertise and SEMATECH’s wealth of knowledge in the field of semiconductor R&D will help the industry better handle the challenges of migration to next generation processes. We are excited about SEMATECH’s commitment to 300mm exploratory research and development and look forward to passing the benefits of this technology relationship to our customers.”

SEMATECH President and CEO Dr. Michael Polcari said, “Our members join me in welcoming UMC to SEMATECH and we look forward to their contributions and technical insight from their perspective as a global leader in 300mm foundry services. UMC will be an important partner in accelerating the progress of R&D innovations into manufacturing solutions.”

In May 2007, UMC opened a new dedicated 300mm R&D center staffed with over 1,000 employees to tackle next generation process technology challenges.

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