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Ultratech buys group of RTP patents from IBM

09 October 2008 | By Mark Osborne | News > Wafer Processing

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Ultratech's advanced Laser Spike Annealing (LSA) technology Ultratech has acquired a range of fundamental patents from IBM, related to rapid thermal annealing. Other patents include temperature control and metrology aspects of the process.

"Ultratech has periodically purchased patents that it views are key to our business," noted Ultratech Chairman and CEO Arthur W. Zafiropoulo. "The acquisition of these patents from IBM is the continuation of that strategy to ensure that our customers receive the highest technology content in their products. This acquisition reinforces our commitment to remain at the forefront of providing equipment with leading-edge technology and low cost-of-ownership advantages for our global customer base."

The patents are intended to strengthen its patent portfolio for annealing steps related to ultra-shallow junction (USJ) formation. Financial details were not disclosed.

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