Through-Silicon Via (TSV) foundry ALLVIA has claimed a new silicon interposer has been developed that solves materials used for TSV’s thermal expansion variances, a key challenge for stacking multiple IC devices. As a result, the start-up has received new funding and has appointed SunSil, Inc. to sell and market its products and services in the United States.
“With our recent TSV work with flip chips on the backside, we have been able to produce a silicon interposer cost-effectively. This advancement has gained nice traction in the industry and it makes sense now to begin our global expansion,” commented Sergey Savastiouk, CEO of ALLVIA. “It will be SunSil’s mission to tell the story that ALLVIA TSVs can help curb the rise in substrate costs and eliminate the requalification process for 3D integration.”
“The various compositions of substrate materials make stacking them for 3D integration difficult due to different coefficients of thermal expansion,” commented Seth Alavi, SunSil President and CEO. “ALLVIA has solved the problem by putting a silicon interposer between two stacked substrates and connecting them with TSVs. As more and more semiconductor companies are looking to TSVs to solve process problems, we are excited to be representing ALLVIA.”
The second round of financing for ALLVIA brings total funding to US$25 million. The proceeds will be used to add more manufacturing capacity.
The company recently announced it had secured a next round of funding, bringing the total investment in the company to $25 million. The Sunnyvale, California-based company is using the new funds to build more manufacturing capacity.