Online information source for semiconductor professionals
TSMCâ??s capital expenditures hit US$3.10 billion in 1H: capex raised to US$4.8 billion
Popular articles
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
TSMC has accelerated its capacity expansion plan for 2010 as demand continues to be strong on that back of growing revenue in the second quarter and guidance of further revenue increase in the third quarter. TSMC’s current capacity plan calls for an overall increase by 14% to 11,299 200mm equivalent wafers, compared with 11,247 8-inch equivalent wafers planned in the last quarter. TSMC guided that 300mm wafer capacity would increase by 36% in 2010 under the current plan. Capital expenditure will be raised again from US$4.8 billion to US$5.9 billion in 2010.“Both macroeconomic forecast and booking trend indicate that third quarter business will continue to grow. Relative to the second quarter, the consumer and communication segments in the third quarter will increase while the computer segment will decline slightly,” said Lora Ho, VP and Chief Financial Officer of TSMC.
TSMC said that its consolidated revenue in the second quarter was NT$104.96 billion. Revenue for the third quarter was expected to be between NT$109 billion and NT$111 billion.
Advanced process technologies (0.13-micron and below) accounted for 72% of wafer revenues. 90nm process technology accounted for 16% of wafer revenues, 65nm 27%, and 40nm16% of total wafer sales.