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TSMC promotes equipment carbon footprint production at supplier forum

08 December 2009 | By Mark Osborne | News > Fab Management

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TSMC made direct reference to the need to reduce its manufacturing carbon footprint at its annual Supply Chain Management Forum, held last week in Taiwan. Some 410 suppliers from around the world in the fields of equipment, materials, packaging, testing, facilities, IT systems and other services gathered under the theme of ‘Thriving amid Economic Uncertainties.’ However, the progressive tone of working on energy efficiency and other carbon reduction strategies will require closer supplier partnerships if this project is to succeed.

“We are very grateful for the full support of our suppliers during these challenging times for the global economy, and we hope to join hand in hand with them to overcome more challenges in the future through even stronger cooperation and closer partnership” said Dr. Stephen Tso, TSMC Senior Vice President and Chief Information Officer. “As we face worsening environmental problems such as global warming, we also hope that our supplier partners can work with us to halt climate change and make an effort to maintain the sustainability of both industry and environment, and to continue their commitment to environmental protection.”

TSMC also recognized suppliers with outstanding overall performance with its annual supplier awards. Some familiar names reappeared, having received awards several times in the past.

The U.S.-based companies however were strongly represented with 5 companies given awards, which included Varian Semiconductor Equipment, Lam Research, MEMC Electronic Materials, Air Products and Chemicals and Cabot Microelectronics.

Interestingly, all of these suppliers have invested considerably over several years to build-up their service and support systems in Taiwan, while others such as Air Products, MEMC and Cabot have either manufacturing or technology centres located in the country, demonstrating that closer support to IC manufacturers is recognised and a strategic business move.

Once again, Japan-based suppliers took a number of awards with 4 out of the 10 awards. Familiar names from previous awards included EBARA Corporation, Hitachi Kokusai Electric and Tokyo Ohka Kogyo.

Only one European based company, ASML was recognised in the supplier awards, though it should be noted that lithography equipment suppliers often struggle to gain high evaluation marks due to the complexity of the tools as well as the high running costs and maintenance required.

The winners of TSMC’s 2009 supplier awards are as follows:

EBARA Corporation – Best Product, CMP Equipment
Hitachi Kokusai Electric – Best Product, Furnaces
Dainippon Screen – Best Delivery Support, Wet Clean Equipment
Varian Semiconductor Equipment – Best Delivery Support, Implanter
ASML Holding – Best Technology Cooperation, Lithography Equipment
Lam Research Corporation – Best Technology Cooperation, Etching Equipment

MEMC Electronic Materials – Supplier Excellence Award, Silicon Wafers
Air Products and Chemicals – Supplier Excellence Award, Gas and Chemical Materials
Cabot Microelectronics – Supplier Excellence Award, CMP Materials
Tokyo Ohka Kogyo – Supplier Excellence Award, Lithography Materials

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