Online information source for semiconductor professionals
TSMC joins Sematech for 20nm IC development
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Sematech has added another major foundry to its ranks in the form of TSMC. This new relationship will see the two companies collaborate on advanced technology development for IC process technologies for the 20nm generation and beyond. These will include extreme ultraviolet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and will also involve a focus on advances needed for the transition to the 450mm wafer size.
Other core members of the Sematech consortium include GlobalFoundries, HP, IBM, Intel, Samsung, UMC and the College of Nanoscale Science and Engineering (CNSE).
“This relationship further reflects our commitment to push the boundaries of innovation and deliver leading-edge technology to our customers,” said Jack Sun, vice president and CTO, Research and Development of TSMC. “This complementary cooperation leverages SEMATECH’s collaborative approach to lead critical industry technology transitions, with TSMC’s position as an industry leader in advanced technology development and manufacturing.”
Recent additions to the Sematech initiative include Advanced Semiconductor Engineering (ASE), Altera, Analog, LSI, ON Semiconductor and Qualcomm.