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TSMC joins Sematech for 20nm IC development
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Sematech has added another major foundry to its ranks in the form of TSMC. This new relationship will see the two companies collaborate on advanced technology development for IC process technologies for the 20nm generation and beyond. These will include extreme ultraviolet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and will also involve a focus on advances needed for the transition to the 450mm wafer size.
Other core members of the Sematech consortium include GlobalFoundries, HP, IBM, Intel, Samsung, UMC and the College of Nanoscale Science and Engineering (CNSE).
“This relationship further reflects our commitment to push the boundaries of innovation and deliver leading-edge technology to our customers,” said Jack Sun, vice president and CTO, Research and Development of TSMC. “This complementary cooperation leverages SEMATECH’s collaborative approach to lead critical industry technology transitions, with TSMC’s position as an industry leader in advanced technology development and manufacturing.”
Recent additions to the Sematech initiative include Advanced Semiconductor Engineering (ASE), Altera, Analog, LSI, ON Semiconductor and Qualcomm.