Online information source for semiconductor professionals
TSMC and IMEC team up to develop ??More-than-Moore? technology platform
Popular articles
??Velocity?? the new buzzword in Intel??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Semiconductor foundry TSMC has taken further steps to create a technology platform using the so-called “More-than-Moore” technology options. Teaming up with nanotechnology company IMEC, the company has established a new Innovation Incubation Alliance with the aim of creating a platform for the development of innovative product solutions.
The companies hope that the combination of their expertise in nanotechnology research and high-volume IC manufacturing will form the ideal foundation upon which to build this collaboration.
The new Alliance will allow companies to trial and validate concepts at product level with help from IMEC’s prototyping process, and rapidly transfer to volume manufacturing using TSMC’s manufacturing platforms.
More-than-Moore technology concepts include mixed-signal elements, 3D-technologies, MEMS processes, Si photonics and BiCMOS/HV.
“We are pleased to expand our collaboration with TSMC in the More-than-Moore field”, said Luc Van den hove, IMEC President and CEO. “By linking IMEC’s R&D skills with TSMC’s manufacturing skills during the product development phase, the transition of More-than-Moore technologies to high volume manufacturing will accelerate.”