Online information source for semiconductor professionals

Tool Orders: ProMOS in follow-on orders with Mattson

12 September 2005 | By Syanne Olson | News > Wafer Processing

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

ProMOS Technologies has awarded Mattson Technology with follow-on orders for its Aspen III ICPHT and Helios RTP systems. The systems are scheduled to begin shipment in September and will be used in ProMOS' 300 mm Fab 3 at Central Taiwan Science Park (CTSP) for the volume production of advanced memory devices, including 512 Mb and 1 Gb DDR2 DRAM stacked capacitors with 90 nm technology.

"We utilize the most advanced technology to expand our DRAM manufacturing capacity and ramp up production, allowing us to deliver high-quality products to the market quickly," said Dr. Len Mei, senior vice president of ProMOS Technologies. "Mattson's high-performance, low-cost-of-ownership strip and RTP systems, along with its excellent customer services in Taiwan, were key elements in our decision to continue to select the company as a business partner to supply our process technology requirements."

Related articles

Tool Order: Mattson wins multiple orders for ‚??paradigmE‚?? etch system - 13 December 2010

Tool Order: Mattson receives follow-on multi-system orders for Etch and strip systems - 22 June 2011

Tool Order: Asia-based foundry purchases resist strip systems from Mattson - 16 June 2010

Tool Order: Mattson gains first Nexion etch system order - 26 March 2008

Tool Order: TSMC weekly equipment roundup includes major follow-on orders for DNS - 25 March 2011

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: