Online information source for semiconductor professionals
Tool Order: U.S.-based IC manufacturer places follow-on Orion order with FSI
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
FSI International has revealed that it has been tapped for another of its Orion single-wafer cleaning tools in a follow-on order from an unnamed U.S. IC manufacturer. The customer in question will use FSI’s eight process chamber system for the fabrication of 32nm BEOL copper/low-k interconnects and for 22nm development activities.
The Orion system, which can cost between $2.5 million and $6 million, depending on the number of process chambers and configuration, will be shipped to the customer by the end of the year.
“This repeat order is especially important to us as it validates the extendibility of our FSI ORION technology for both 45nm and 32nm BEOL manufacturing and 22nm BEOL development,” said Don Mitchell, FSI’s president and CEO. “Concurrently, a major Korean customer is evaluating the FSI ORION system for FEOL applications, including our patented ViPR™+ technology that is being utilized to remove highly implanted photoresist with a unique one-step process.”