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Tool Order: TSMC to use JVX 6200 X-ray metrology tool

15 April 2009 | By Jon Haines | News > Wafer Processing

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TSMCJordan Valley Semiconductors LTD, has announced TSMC will use the JVX 6200 X-ray metrology tool in order to measure the thickness of thin-film copper layers in TSMC.

Jordan Valley's President and CEO, Isaac Mazor said, "We are pleased and proud with the outcome of this evaluation. We see TSMC not only as a valued strategic customer, but also as a technological leader. TSMC's decision is recognition of XRR as the technology-of-choice for copper layer thickness metrology in our products. We are looking forward to continue supporting their metrology needs as they evolve."

Comparing potential technologies in X-ray against opto-acoustic, the company announced, "We found that X-ray reflectometry (XRR) demonstrated the required capability. Among the evaluated X-ray based tools, the JVX 6200 for its superior precision in the sub-angstrom range and for its lower total cost of ownership."

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