Online information source for semiconductor professionals

Tool Order: TSMC purchases wafer bonding equipment from EV Group

01 September 2011 | By Mark Osborne | News > Wafer Processing

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

TSMC hosts 2008 Green Forum on ‚??green‚?? factories - 31 October 2008

A significant number of orders over a decent period were placed by TSMC for what is believed to be for wafer bonding equipment from EV Group. The batch of orders totalled approximately US$38.7 million.

These are believed to be the first of such orders officially announced by TSMC this year with EV Group.

Related articles

Tool order: SEMATECH orders EVG 300mm GEMINI wafer bonder - 10 July 2009

Tool order: EV Group ships GEMINI wafer bonder to EPCOS - 05 June 2009

Tool order: EV Group completes two follow-on orders for fusion bonding systems - 06 October 2009

Order focus: TSMC returns to capital spending foray - 25 May 2011

Tool Order: TSMC places batch of tool orders with KLA-Tencor - 25 July 2011

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: