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Tool Order: TSMC places equipment orders with Nexx Systems and TEL

11 February 2011 | By Mark Osborne | News > Wafer Processing

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Nexx SystemsTSMC has placed equipment orders with Tokyo Electron (TEL) and Nexx Systems valued at US$26.6 and US$21.3 million, respectively as new documents filed with the Taiwan Stock Exchange show. Nexx Systems primarily supplies wafer level packaging equipment such as through-silicon via (TSV) technology.

In total, the orders amount to approximately US$44.7 million. A running total of capital expenditure notifications from TSMC indicate that the foundry has purchased approximately US$324 million of equipment so far this year.

TSMC is expected to spend a massive US$7.8 billion for 2011.

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