TSMC has placed equipment orders with Tokyo Electron (TEL) and Nexx Systems valued at US$26.6 and US$21.3 million, respectively as new documents filed with the Taiwan Stock Exchange show. Nexx Systems primarily supplies wafer level packaging equipment such as through-silicon via (TSV) technology.
In total, the orders amount to approximately US$44.7 million. A running total of capital expenditure notifications from TSMC indicate that the foundry has purchased approximately US$324 million of equipment so far this year.
TSMC is expected to spend a massive US$7.8 billion for 2011.