Online information source for semiconductor professionals

Tool Order: TSMC places equipment orders with Nexx Systems and TEL

11 February 2011 | By Mark Osborne | News > Wafer Processing

Popular articles

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

Nexx SystemsTSMC has placed equipment orders with Tokyo Electron (TEL) and Nexx Systems valued at US$26.6 and US$21.3 million, respectively as new documents filed with the Taiwan Stock Exchange show. Nexx Systems primarily supplies wafer level packaging equipment such as through-silicon via (TSV) technology.

In total, the orders amount to approximately US$44.7 million. A running total of capital expenditure notifications from TSMC indicate that the foundry has purchased approximately US$324 million of equipment so far this year.

TSMC is expected to spend a massive US$7.8 billion for 2011.

Related articles

Tool Order: ASML receives belated US$108 million Xmas present from TSMC - 05 January 2012

NEXX Systems names Tsuyoshi Kotaki as sales director, Japan - 24 June 2009

UMC places orders with ASML and TEL - 01 April 2011

Tool Order: TSMC places batch of tool orders with KLA-Tencor - 25 July 2011

Daniel O‚??Connell takes over as Director of North America Sales at NEXX Systems - 04 March 2009

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: