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Tool Order: Tokyo Electron receives orders for new Trias HP Ti metal CVD system

01 April 2008 | By Síle Mc Mahon | News > Wafer Processing

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Tokyo ElectronTokyo Electron has said that its newly launched Trias HP Ti metal CVD deposition system is winning orders from across all regions. The new system employs a proprietary showerhead gas dispersion system with optimized surface treatments that reduce particle-related film defects for 32nm processing requirements. 

“The unique low-temperature processing technology offered by TEL’s new metal CVD system will enable device makers to address the requirements for metal contacts at the 32nm node and beyond,"said Kenji Washino, General Manager for TEL’s Single Wafer Deposition Business Unit. "The Trias HP Ti exemplifies TEL’s commitment to providing cost-effective manufacturing solutions to our customers’ most advanced process technology needs.”

Based on TEL’s Trias platform, the Trias HP Ti is claimed by TEL to be unique in its ability to deposit titanium (Ti) films over a wide temperature range, including temperatures that are lower than those typically required by conventional Ti CVD reactors.

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