Online information source for semiconductor professionals

Tool Order: Texas Instruments purchases ADE‚??s new NanoXam metrology tool

08 November 2005 | By Syanne Olson | News > Wafer Processing

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

ADE Corporation has stated that after an on-site evaluation program with a DSP and analog IDM, believed to be Texas Instruments, the chip manufacturer are purchased one NanoXam non-contact patterned surface wafer metrology system.

The NanoXam system was selected by one of the company's 300mm production facilities to control dishing and erosion in leading edge CMP processes and to develop processes for 45nm node advanced products, according to the company.

"As part of our growth strategy to extend ADE's advanced surface topography technology into the semiconductor device fab, we have been working with a leading semiconductor manufacturer to test NanoXam in a world class fabrication environment," stated Dr. Chris L. Koliopoulos, president and chief executive officer of ADE Corporation. "This opportunity for copper and tungsten applications development has allowed ADE to gain leading edge CMP yield experience and to tailor our NanoXam patterned wafer tool as a cost effective, in-line process control solution...The NanoXam system provides true 3-D wafer surface topography measurements, enabling customers to quickly optimize and monitor leading edge processes, including tungsten and copper CMP and copper ECD, by allowing non-contact measurements in active areas of product die or on scribe line monitors," continued Dr. Koliopoulos.

Related articles

AFM in silicon technology development - 01 August 2005

Resource Optimisation for 300mm - 01 June 2000

Tool Order: Nova notes 5 new customers and 7 separate multiple metrology installs - 08 July 2010

Atomic Force Profilometry for Chemical Mechanical Polishing Metrology - 01 March 2000

TI places bid for Qimonda manufacturing equipment - 25 August 2009

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: