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ADE Corporation has stated that after an on-site evaluation program with a DSP and analog IDM, believed to be Texas Instruments, the chip manufacturer are purchased one NanoXam non-contact patterned surface wafer metrology system.

The NanoXam system was selected by one of the company's 300mm production facilities to control dishing and erosion in leading edge CMP processes and to develop processes for 45nm node advanced products, according to the company.

"As part of our growth strategy to extend ADE's advanced surface topography technology into the semiconductor device fab, we have been working with a leading semiconductor manufacturer to test NanoXam in a world class fabrication environment," stated Dr. Chris L. Koliopoulos, president and chief executive officer of ADE Corporation. "This opportunity for copper and tungsten applications development has allowed ADE to gain leading edge CMP yield experience and to tailor our NanoXam patterned wafer tool as a cost effective, in-line process control solution...The NanoXam system provides true 3-D wafer surface topography measurements, enabling customers to quickly optimize and monitor leading edge processes, including tungsten and copper CMP and copper ECD, by allowing non-contact measurements in active areas of product die or on scribe line monitors," continued Dr. Koliopoulos.