Online information source for semiconductor professionals
Tool order: Tegal receives follow-on order for 4200 SE cluster tool
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Tegal has been tapped for another of its Tegal 4200 SE DRIE cluster tool process modules from an unnamed Europe-based MEMS and power IC device supplier. This order follows the successful installation, process qualification and use of the previous tool for silicon deep reactive ion etch (DRIE) processes. The tool is set for shipment and installation at the customer’s site in the next fiscal quarter.
“Our customer is known for their technological leadership in the MEMS and Power IC markets, and we see this repeat order as confirmation of the Tegal silicon DRIE tool’s superior performance in high volume manufacturing,” said Yannick Pilloux, DRIE Product Manager at Tegal Corporation. “We believe that our DRIE process modules are the most reliable and most advanced on the market and, as this repeat order shows, we have been able to meet our customer’s demanding technical requirements for silicon DRIE cluster tools, while providing excellent value along the way.”
Tegal’s silicon DRIE tools are being used in MEMS foundries as well as several research and development laboratories globally for both commercial and academic research applications.