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Tool order: Taiwanese foundry places multiple CMP inspection systems order with Rudolph

08 December 2009 | By Mark Osborne | News > Wafer Processing

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A major Taiwanese foundry has placed a multiple systems orders with Rudolph Technologies for its latest ‘Explorer’ Inspection Cluster, which is used for defect monitoring of the Chemical Mechanical Polish (CMP) process. The Explorer Inspection Cluster is a modular approach to wafer inspection that may include one or more inspection modules for the wafer’s front, back or edge surfaces.

“The Explorer System’s new waferless recipe creation capability was a key factor in this foundry’s purchase decision,” noted Scott Balak, Rudolph’s All-Surface Inspection Product Manager. “With the Explorer Cluster creating recipes automatically, the customer benefits from both enhanced tool productivity as well as a more efficient use of their personnel and material.”

The orders include new systems as well as upgrades for previously installed equipment.

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