A major Taiwanese foundry has placed a multiple systems orders with Rudolph Technologies for its latest ‘Explorer’ Inspection Cluster, which is used for defect monitoring of the Chemical Mechanical Polish (CMP) process. The Explorer Inspection Cluster is a modular approach to wafer inspection that may include one or more inspection modules for the wafer’s front, back or edge surfaces.
“The Explorer System’s new waferless recipe creation capability was a key factor in this foundry’s purchase decision,” noted Scott Balak, Rudolph’s All-Surface Inspection Product Manager. “With the Explorer Cluster creating recipes automatically, the customer benefits from both enhanced tool productivity as well as a more efficient use of their personnel and material.”
The orders include new systems as well as upgrades for previously installed equipment.