Online information source for semiconductor professionals

Tool Order: Taiwan DRAM manufacturer selects inspection package from Rudolph

15 June 2009 | By Mark Osborne | News > Wafer Processing

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

A Taiwan DRAM manufacturer has ordered the Explorer ‘total solution package’ from Rudolph Technologies that includes the AXi940 front side inspection module, B30 backside inspection module, E30 edge inspection module and its Discover software package for inline defect analysis and data management. Also included in the deal is Rudolph’s TrueADC software for inline automatic defect classification.

“Edge bevel inspection, in particular, is becoming more important as we move through 45nm and beyond, and especially as immersion lithography has been introduced into advanced manufacturing processes,” commented Scott Balak, Rudolph’s All-Surface Inspection Product Manager. “Defects originating in non-exposure areas, including streets, partial devices and the edge of the wafer, all have the potential to create problems within the immersion environment. Edge-related processes, such as edge bead removal, need to be monitored closely to control performance and defectivity.”

 

Related articles

Tool Order: Singapore fab places multiple inspection system order with Rudolph - 08 May 2008

Tool Order: Rudolph receives multiple tool orders from China & Asia - 24 July 2009

Tool Order: Rudolph ships multiple TSV inspection and metrology systems - 03 October 2011

Tool Order: Rudolph wins multiple back-end orders for NSX inspection system - 11 January 2011

Tool Order: Avago to use Rudolph‚??s NSX inspection systems for optoelectronic devices - 04 February 2011

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: