A major Asian memory manufacturer has placed an order with SUSS MicroTec Test Systems for a 300mm wafer-level probe system, the PA300PS. The decision follows a six-month, head-to-head comparison against the incumbent and major competition for wafer-level test solutions at the manufacturer’s facilities, the company said. The system will be used for IC device characterization and reliability testing.
“The engineers at the manufacturer chose ProbeShield Technology due to the superior measurement results and significant time savings the advanced feature sets provide,” said Rob Carter, Vice President of Marketing and Sales for SUSS MicroTec Test Systems. “They were particularly impressed with the unattended test capabilities that are provided with the unique ‘Automated Thermal Management’ (ATM) and ‘ReAlign’ functions.”