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Tool Order: Suss MicroTec Test Systems wins competitive head-to-head probe evaluation

28 April 2009 | By Mark Osborne | News > Wafer Processing

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A major integrated device manufacturer located in the United States has selected Suss MicroTec Test Systems PA300PS 300mm wafer-level probe system for device characterization and reliability test after an extensive head-to-head comparison against other suppliers of wafer-level test solutions.

“The engineers at the manufacturer chose ProbeShield Technology due to the superior positioning accuracy especially on small pads and significant time savings provided by advanced automation features such as ReAlign Technology for automatic alignment of probe tips to pads after a temperature change,” said Rick Dock, VP of North American sales at Suss MicroTec.

As a result of the competitive win, Suss MicroTec has been named the exclusive supplier of on-wafer characterization systems for three years, according to the company.

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