Online information source for semiconductor professionals
Tool Order: Strasbaugh receives US$3.6 million deal multiple wafer grinders
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Strasbaugh has received a US$3.6 million order for multiple nTellect (Model 7AF), 200mm wafer grinding systems. Shipments to the un-specified customer are due before year-end 2009.
"The nTellect is a proven product suitable for a broad range of applications, from conventional semiconductor wafer backgrinding to unique surfacing applications, including hard and exotic materials," said Mike Kirkpatrick, Strasbaugh's VP of Sales and Marketing. "The system's force-adaptive, in-feed wafer grinding technology combined with ultra-stiff air bearings, sub-micron feed rates, and rigid tool construction provides customers with improved surface finish, repeatable thickness control, and reduced sub-surface damage," adds Kirkpatrick.