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Tool Order: STMicroelectronics places major order for 300mm TSV tools with EV Group

09 July 2008 | By Mark Osborne | News > Wafer Processing

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EVG HerculesSTMicroelectronics has placed a multi-million euro order with EV Group for a number of tools required for processing 300mm wafers for through-silicon-via (TSV) applications. The tools have been supplied and installed at STMicroelectronics’ Crolles2 pilot line in Crolles, France. The tools include EVG’s EVG150 Coater and EVG150 Developer and its new NanoSpray photoresist coating processing capabilities for steep topographies as part of its IQ Aligner.

"ST is committed to accelerating the manufacturing of 3D TSV-based devices into high volume,” commented Gareth Bignell, Program Manager, 300mm Equipment Selection, STMicroelectronics. “As such, we're turning to trusted suppliers, like EVG, who can help us maintain our competitive edge by minimizing manufacturing risks, while increasing the speed of implementation and time to market.  At the same time, we also expect nothing less than superior and comprehensive service and support so that our facility can continue to run at benchmark levels - we expect that EVG's solid and dependable support will continue to be a significant help in this area."

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