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Tool Order: STMicroelectronics places major order for 300mm TSV tools with EV Group
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STMicroelectronics has placed a multi-million euro order with EV Group
for a number of tools required for processing 300mm wafers for
through-silicon-via (TSV) applications. The tools have been supplied
and installed at STMicroelectronics’ Crolles2 pilot line in Crolles,
France. The tools include EVG’s EVG150 Coater and EVG150 Developer and
its new NanoSpray photoresist coating processing capabilities for steep
topographies as part of its IQ Aligner.
"ST is committed to accelerating the manufacturing of 3D TSV-based devices into high volume,” commented Gareth Bignell, Program Manager, 300mm Equipment Selection, STMicroelectronics. “As such, we're turning to trusted suppliers, like EVG, who can help us maintain our competitive edge by minimizing manufacturing risks, while increasing the speed of implementation and time to market. At the same time, we also expect nothing less than superior and comprehensive service and support so that our facility can continue to run at benchmark levels - we expect that EVG's solid and dependable support will continue to be a significant help in this area."