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Tool Order: SPTS wins multi-systems order for through silicon via TSV structures for 3D-IC packaging

26 April 2011 | By Mark Osborne | News > Wafer Processing

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SPTS Omega Etch fabricating a scallo-free TSVA multi-system and product order has been hailed as marking a new market penetration for SPP Process Technology Systems (SPTS), which includes a suite of equipment to be used for the fabrication of through silicon via (TSV) structures for 3D-IC packaging. Customer details were not disclosed except that the order was placed by a leading outsourced semiconductor assembly and test (OSAT) provider in the Asia-Pacific region.

The customer ordered Sigma PVD, Omega Etch and Delta CVD wafer processing systems.

“SPTS won this multi-system order through data sharing, on-wafer demonstration and customer references,” said Kevin Crofton, chief operating officer and managing director of the Single Wafer Division. “Our team of engineers was able to enhance and fine-tune our customer’s processes in an integrated manner leading to a positive decision for their 3D-IC line. Pure-play packaging houses rely on our TSV integration knowledge to help accelerate their time to market, with proven return on capital investment (ROI).”

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