Online information source for semiconductor professionals

Tool Order: Six customers now adopted FSI‚??s ‚??ORION‚?? single wafer cleaning system

30 September 2011 | By Mark Osborne | News > Wafer Processing

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

A leading Asian foundry producer has given FSI International final acceptance of an ‘ORION’ single wafer cleaning system, marking the sixth customer that has adopted the platform and technology. The latest customer qualified the system for 28nm FEOL processes and will use it for all-wet photoresist stripping applications using the high-temperature ‘ViPR’ process. FSI said it expects to recognize revenue for this system in the first quarter of fiscal 2012.

Related articles

Tool Order: FSI to supply ‚??ORION‚?? single wafer cleaning system - 18 March 2010

Tool Order: FSI wins new order from initial ORION cleaning tool customer - 07 January 2009

Tool Order: FSI‚??s new ‚??ORION‚?? single wafer cleaning system in 32nm BEOL evaluation - 20 May 2008

Tool Order: FSI receives acceptance confirmation of new ‚??ORION‚?? cleaning tool - 24 December 2008

Tool Order: FSI International wins repeat order from foundry - 07 July 2011

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: