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Tool Order: Singapore fab places multiple inspection system order with Rudolph

08 May 2008 | By Mark Osborne | News > Wafer Processing

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RudolphA major chip manufacturer based in Singapore has placed a multiple (3) systems order with Rudolph Technologies for its recently introduced AXi 940 macro defect inspection module. According to Rudolph, the order was received after a successful evaluation process by the chip manufacturer for advanced lithography and CMP applications.

“The size of the order puts us ahead of our own projections for this tool,” commented Scott Balak, AXi inspection Product Manager, “but more significantly, it affirms the design choices we made and the value this customer recognizes in the resulting product. Clearly, the productivity, accuracy and reliability of the new tool were apparent in this evaluation, and we expect rapid adoption of the AXi 940 in these important market segments.”

Two systems shipped in April, with the third scheduled for June, Rudolph said.

 

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