A major Korean memory manufacturer and a Korea-based IC packaging foundry have placed orders for a total of six Raider systems that will be used for electroplating, metal etch and photoresist stripping as well as advanced bumping, Cu Pillar, UBM Etch and resist strip applications. Specialty chip interconnect metals used in 3D-TSV (through silicon via) applications are further uses for the tools, Semitool said.
"Wafer-level packaging, specifically associated with advanced copper devices and memory applications, is one of the fastest growing segments in semiconductor industry today," said Dan Schmauch, Director of Semitool's Advanced Packaging Division. "These bookings represent follow-on orders and add to our base of more than 85 Asia Pacific Raider tools installed over the last four years. WLP Raider tools alone account for more than 50 tools in the Asia Pacific region."