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Tool Order: SEMATECH orders wafer level bonder from SET

01 September 2009 | By Mark Osborne | News > Wafer Processing

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SEMATECH has placed an order with Smart Equipment Technology (SET), a subsidiary of Replisaurus Technologies for its Device Bonder FC300, which will be used at SEMATECH’s 3D R&D Center at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex in Albany, N.Y. The order was booked earlier this year and the delivery of the machine is scheduled for the end of 2009.

“Our comprehensive program is aimed at enabling the manufacturability of 3D interconnects, and will benefit from this versatile platform that addresses the broad spectrum of our member companies’ bonding requirements,” said Sitaram Arkalgud, SEMATECH’s 3D Program Director.

The FC300 is a new generation of high accuracy (0.5 µm), high force (4,000N) device bonder for chip-to-chip and chip-to-wafer bonding on wafers up to 300mm.

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