Online information source for semiconductor professionals
Tool Order: Rudolph wins multiple WaferWoRx 300 Probing system deal
Popular articles
Voltaix names Peter Smith as CEO - 09 November 2011
Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010
TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
A major European semiconductor manufacturer has ordered two ‘WaferWoRx’ 300 Probing Process Analysis Systems from Rudolph Technologies. The orders were placed as part of a multi-tool agreement signed in June 2008.
“This is a significant sale for an important product recently added to Rudolph’s back-end portfolio,” noted Rudolph’s Probe Card Test and Analysis Product Manager, Darren James, “We are investing heavily in these products and technologies; we believe they will enable our customers to improve their operating performance and allow us to maintain our position as the leading supplier of backend inspection, metrology and process control solutions.”