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Tool Order: Rudolph wins multiple WaferWoRx 300 Probing system deal

04 September 2008 | By Mark Osborne | News > Wafer Processing

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A major European semiconductor manufacturer has ordered two ‘WaferWoRx’ 300 Probing Process Analysis Systems from Rudolph Technologies. The orders were placed as part of a multi-tool agreement signed in June 2008.

“This is a significant sale for an important product recently added to Rudolph’s back-end portfolio,” noted Rudolph’s Probe Card Test and Analysis Product Manager, Darren James, “We are investing heavily in these products and technologies; we believe they will enable our customers to improve their operating performance and allow us to maintain our position as the leading supplier of backend inspection, metrology and process control solutions.”

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