Online information source for semiconductor professionals
Tool Order: Rudolph wins multiple back-end orders for NSX inspection system
Popular articles
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008
Samsung and Micron gain most market share in DRAM crisis - 17 February 2009
A major European semiconductor manufacturer has placed multiple orders for Rudolph’s NSX Inspection System, which will be used in back-end manufacturing for high-throughput inspection of automotive semiconductor devices. Rudolph said that shipments would begin in the first quarter of this year and continue through the second quarter.“Automotive semiconductor makers have discovered that the earlier a defect is detected in the wafer manufacturing process, the cheaper it is to resolve yield-killing fabrication problems,” noted Rajiv Roy, Rudolph’s vice president of business development and director of back-end marketing. “This results in a higher quality product for their customers.”
The NSX115 Automated Inspection System is said to be optimized specifically for the back-end manufacturing environment.