A major European semiconductor manufacturer has placed multiple orders for Rudolph’s NSX Inspection System, which will be used in back-end manufacturing for high-throughput inspection of automotive semiconductor devices. Rudolph said that shipments would begin in the first quarter of this year and continue through the second quarter.
“Automotive semiconductor makers have discovered that the earlier a defect is detected in the wafer manufacturing process, the cheaper it is to resolve yield-killing fabrication problems,” noted Rajiv Roy, Rudolph’s vice president of business development and director of back-end marketing. “This results in a higher quality product for their customers.”
The NSX115 Automated Inspection System is said to be optimized specifically for the back-end manufacturing environment.