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Tool Order: Rudolph ships multiple TSV inspection and metrology systems

03 October 2011 | By Mark Osborne | News > Wafer Processing

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Rudolph Technologies has shipped its ‘Wafer Scanner 3880 3D Inspection System,’ multiple ‘NSX’ Macro Defect Inspection Systems and its ‘Discover’ Yield Management Software Suite to a leading semiconductor manufacturer. The customer will use the systems for developing through silicon via (TSV) based processes for advanced 3D IC integration.

“We continue to see aggressive development efforts among our leading customers in the development of advanced 3D integration technologies using TSVs, micro bumps and complex back-end stacking and packaging processes,” said Reza Asgari, Rudolph’s Wafer Scanner product manager. “Although it is clear that 3D integration will come, the details of its implementation for many applications are still being developed.”

The Wafer Scanner Inspection System handles yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes. The NSX Inspection platform offers specific inspection solutions for processes using TSVs to connect multiple die in a single package.

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