New and repeat customers in China and Taiwan have placed orders with Rudolph Technologies ‘Wafer Scanner 3840’ and ‘NSX’ Series back-end inspection tools. Some of the systems have already been shipped.
“The new Wafer Scanner 3840 won a competitive comparison at a China fab based on accuracy and repeatability,” commented Rajiv Roy, Rudolph’s Vice President of Business Development and Director of Back-end Marketing. “In Taiwan, a packaging and test customer with several Rudolph Systems installed, has chosen the WS3840 to meet increasing demand for bump metrology and defect inspection.”