Multiple system orders from a major Asian foundry and an IDM have been awarded to Rudolph Technologies for its latest ‘MetaPULSE-G’ opaque metrology tool. The systems are designed to be used for copper interconnect metrology requirements at the 32nm node and below. Deliveries started in Q410 and due to through Q311, according to the company.
“Interconnect metrology is becoming more challenging as our customers move to the 32nm process node and below. Thinner interconnect layers are driving needed improvements in film stack measurement precision and repeatability,” commented Tim Kryman, Rudolph’s metrology business product manager. “In addition, pattern-dependent deposition characteristics exhibited in today’s advanced processes are pressing IDMs and foundries to move from monitor wafer and scribe line measurements to on product metrology.